Dowa Metaltech Co., Ltd.

Kuniaki Miyagi

Akira Sugawara

Hiroto Narieda

Tomotsugu Aoyama

Hideki Endo

Takashi Suga

Tsuyoshi Ito

A copper alloy sheet material contains, in mass %, Fe: 0.05 to 2.50%, Mg: 0.03 to 1.00%, and P: 0.01 to 0.20%, and the contents of these elements satisfy the relation Mg-1.18(P&#x2014;Fe/3.6)0.03. The Mg solid-solution ratio determined by the amount of dissolved Mg (mass %)/the Mg content of the alloy (mass %) ' 100 is 50% or more. The density of an Fe&#x2014;P-based compound having a particle size of 50 nm or more is 10.00 particles/10 mmor less, and the density of an Mg&#x2014;P-based compound having a particle size of 100 nm or more is 10.00 particles/10 mmor less. The Cu&#x2014;Fe&#x2014;P&#x2014;Mg-based copper alloy sheet material is excellent in terms of electrical conductivity, strength, bending workability, and stress relaxation resistance in the case where load stress is applied in a direction perpendicular to both a rolling direction and a sheet thickness direction.

Copper alloy sheet material and current-carrying component

A copper alloy sheet material has a copper alloy component system that has a high conductivity of 75.0% IACS or more and has both high strength and good stress relaxation resistance characteristics. A copper alloy sheet material has a composition containing, by mass %, from 0.01 to 0.50% of Zr, from 0.01 to 0.50% of Sn, a total content of from 0 to 0.50% of Mg, Al, Si, P, Ti, Cr, Mn, Co, Ni, Zn, Fe, Ag, Ca, and B, with the balance Cu, and unavoidable impurities, and a metal structure having a number density NOf fine second phase particles having a particle diameter of approximately from 5 to 50 nm of 10.0 per 0.12 mmor more and a ratio N/Nof a number density N(per 0.012 mm) of coarse second phase particles having a particle diameter exceeding approximately 0.2 mm and the Nof 0.50 or less.

Copper alloy sheet material

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Tokyo, Japan

Kuniaki Miyagi