Denso Corporation

Nippon Soken, Inc.

Kuniaki Mamitsu

Takanori Teshima

Masayoshi Nishihata

Yasuyoshi Hirai

Hiroyuki Wado

Naohiko Hirano

Yoshimi Nakase

Chikage Noritake

Takahisa Kaneko

Toshiki Itoh

Masaya Tonomoto

Eiji Nomura

Yutaka Fukuda

Tetsuo Fujii

Tomoatsu Makino

Yasushi Ookura

Keita Fukutani

Daisuke Fukuoka

Kazuhito Nomura

Sadahisa Onimaru

Tomomi Okumura

Takeshi Miyajima

Yoshitsugu Sakamoto

Hirohito Matsui

Yasuyuki Ohkouchi

Naoki Hirasawa

Nobuyuki Kato

Kenichi Oohama

Yasushi Okura

Akira Tai

Kazuo Akamatsu

Akira Mochida

Kazuo Kajimoto

Kenji Yagi

Tomoo Iwade

Syun Sugiura

Ken Sakamoto

A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

Semiconductor device

A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Semiconductor device including cooler

A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a back-surface electrode on its back surface. The resin member encapsulates the semiconductor element. The front-surface electrode is exposed to a front side of an outer surface of the resin member. The back-surface electrode is exposed to a back side of the outer surface of the resin member. The resin member has an extension portion that covers the entire side surface of the semiconductor element and extends from the side surface of the semiconductor element in a direction parallel to the front surface of the semiconductor element.

Semiconductor device with surface electrodes

Semiconductor package cooled by grounded cooler

In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base material includes embedding portions in which the electronic parts are embedded and a bent portion having flexibility between the embedding portions. The cooler has fixing parts arranged in a first direction. The circuit board is fixed to the cooler while bending the bent portion. The bent portion is opposed to an end portion of one of the fixing parts, and each of the embedding portions is held between adjacent two fixing parts such that opposite surfaces of the embedding portion are closely in contact with surfaces of the adjacent two fixing parts.

Fixing structure and fixing method of circuit board with embedded electronic parts to cooler

In a semiconductor module, a first heat sink is disposed on a rear surface of a first semiconductor chip constituting an upper arm, and a second heat sink is disposed on a front surface of the first semiconductor chip through a first terminal. A third heat sink is disposed on a rear surface of a second semiconductor chip constituting a lower arm, and a fourth heat sink is disposed on a front surface of the second semiconductor chip through a second terminal. A connecting part for connecting between the upper arm and the lower arm is integral with the first terminal, and is connected to the third heat sink while being inclined relative to the first terminal.

Semiconductor module and method of manufacturing the same

A semiconductor device includes a first protection film for covering a first metal wiring. A second protection film is disposed on the first protection film, which is covered with a solder layer. Even if a crack is generated in the second protection film before the solder layer is formed on the second protection film, the crack is restricted from proceeding into the first protection film.

Semiconductor device having semiconductor chip and metal plate

A semiconductor apparatus having a first surface and a second surface opposite to the first surface includes: a semiconductor chip having a front side and a backside; a first heat radiation member electrically and thermally coupled with the backside of the chip; a second heat radiation member electrically and thermally coupled with the front side of the chip; and a resin mold sealing the first and second heat radiation members together with the chip. At least one of the first and second heat radiation members is exposed on both of the first and second surfaces.

Semiconductor apparatus having a two-side heat radiation structure

A semiconductor module has switching semiconductor elements connected in parallel to each other and at least a free wheeling semiconductor element reversely connected in parallel to the switching semiconductor elements. The free wheeling semiconductor element is placed between the switching semiconductor elements. At both end parts of the semiconductor elements, each of the switching semiconductor elements is placed. A longitudinal side of each of the switching semiconductor elements and the free wheeling semiconductor element is placed in parallel to a short side of the semiconductor module. An electric-power conversion device has a plurality of arms. Each arm is composed of the semiconductor elements.

Semiconductor module

A semiconductor module and a method of manufacturing the same are disclosed including a semiconductor element having an electrode, a heat radiation plate placed in thermal contact with a main surface of the semiconductor element and electrically connected to the electrode thereof, an insulation body directly formed on an outside surface of the heat radiation plate, a metallic body directly formed on an outside surface of the insulation body and having a thickness lower than that of the insulation body, and a mold resin unitarily molding the heat radiation plate, the semiconductor element and the insulation body. The insulation body is covered with the metallic body and the mold resin and the metallic body has an outside surface exposed to an outside of the mold resin.

Semiconductor module molded by resin with heat radiation plate opened outside from mold

A semiconductor device includes: a semiconductor element; a metallic plate having a heat radiation surface; a terminal connecting to the element; and a resin mold covering the element, the plate and the terminal. The metallic plate provides an electrode of the semiconductor element. The heat radiation surface is capable of radiating heat generated in the element. The heat radiation surface and a part of the terminal are exposed from the resin mold. The resin mold includes a concavity/convexity portion between the heat radiation surface and the part of the terminal in order to lengthen a creepage distance therebetween. The concavity/convexity portion is disposed on a surface of the resin mold.

Resin mold type semiconductor device

A power semiconductor device includes a power semiconductor element, a protection circuit, an inspection terminal, and an electrical conductor. The protection circuit includes multiple zener diodes connected in series between a gate and an emitter of the power semiconductor element. The protection circuit limits a voltage between the gate and emitter of the power semiconductor element, when an abnormal voltage is applied to the gate. The electrical conductor electrically connects the inspection terminal to a node between the zener diodes of the protection circuit. The zener diodes are separately inspected by using the inspection terminal.

Power semiconductor device

Growing community of inventors

Okazaki, Japan

Kuniaki Mamitsu