Hitachi Cable, Inc.

Hitachi Cable Fine-Tech, Ltd.

Kuniaki Kimoto

Hiromitsu Kuroda

Hiroshi Okikawa

Hajime Nishi

Ken Takahashi

Hiroyuki Akutsu

Iku Higashidani

Yukio Ito

A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120&#xb0; C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.

Solar cell lead, method of manufacturing the same, and solar cell using the same

Growing community of inventors

Hitachi, Japan

Kuniaki Kimoto