Ememory Technology Inc.

Kung-Hong Lee

Ching-Hsiang Hsu

Ya-Chin King

Ching-Sung Yang

Meng-Yi Wu

Shih-Jye Shen

Fu-Yuan Chen

Ching-Song Yang

Hsin-Fen Chou

Ming-Chou Ho

Ming-Chiu Ho

Ya-Chin Kin

An electrically erasable programmable logic device (EEPLD) contains a P-type substrate. A first N-type doped region is disposed in the P-type substrate. A first gate, which is used to store data, overlies the P-type substrate and is adjacent to the first N-type doped region. A second N-type doped region is laterally disposed in the P-type substrate. The second N-type doped region is also adjacent to the first gate. A second gate, which acts as a select gate or select gate of the EEPLD, overlies the P-type substrate and is adjacent to the second N-type doped region. A third N-type doped region is disposed in the P-type substrate. The third N-type doped region is adjacent to the second gate. By Applying a sufficient voltage on the first N-type doped region (V), and changing a select gate voltage (V) or the third N-type doped region voltage (V) applied on the second gate of the EEPLD, the operation of the EEPLD can be selectively implemented either under a channel hot hole (CHH) program mode or a channel hot electron (CHE) erase mode.

Method for operating N-channel electrically erasable programmable logic device

An electrically erasable programmable logic device includes a P-type substrate, a first N-type doped region located inside the P-type substrate, and a first gate located on the P-type substrate. The first gate is adjacent to the first N-type doped region, is in a floating state, and is used for storing data. A second N-type doped region is located inside the P-type substrate adjacent to the first gate. A second gate is located on the P-type substrate and adjacent to the second N-type doped region and acts as a select gate. A third N-type doped region is located inside the P-type substrate adjacent to the second gate.

Electrically erasable programmable logic device

A method of forming and operating a trench split-gate non-volatile flash memory cell structure. The auxiliary gate of the structure is formed inside a trench on one side of the gate and the source terminal is underneath the auxiliary gate, thereby reducing overall area occupation of the auxiliary gate and the source terminal relative to the cell and increasing packing density. By enclosing the common source terminal inside a deep N-well layer, source resistance for reading data from the cell is reduced and the process of etching out a contact opening is simplified. The structure also ensures the injection of most hot electrons into the floating gate, thereby increasing execution speed.

Method of forming and operating trench split gate non-volatile flash memory cell structure

A flash memory cell with an embedded gate structure capable of storing two bits of information and the operation of such a flash memory cell are provided. A first ion-doped region, serving as a source terminal, is formed in a semiconductor substrate. An embedded gate structure and a second ion-doped region are alternately arranged on the first ion-doped region. The embedded gate structure is surrounded by the first oxide layer, the trapping layer, and the second oxide layer. An insulating layer is formed on the embedded gate structure. A diffusion drain is positioned atop the second ion-doped region and a conductive layer connects with the diffusion drains. The embedded gate structure is isolated from the diffusion drain with the insulating layer. Furthermore, the reading, programming, and erasing operation of the memory cell with two bits of information are provided.

Method for operating a nonvolatile memory having embedded word lines

Nonvolatile memory having embedded word lines

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Ping-Tung Hsien, Taiwan

Kung-Hong Lee