Honeywell International Inc.

Honeywell G.m.b.h.

Kundan L Malik

James D Cook

Brian John Marsh

Kenneth E Gall

Arthur Wayne Dawson

A pressure sensor apparatus is disclosed herein, which generally includes a sensor element, a flexible sensor diaphragm in intimate contact with the sensor element at all pressure levels and temperatures, and a package base and a package cover for hermetically sealing the sensor element and the flexible sensor diaphragm within a hermetically sealed sensor package to provide pressure sensor data thereof. The sensor element can be implemented as a quartz sense element to produce a SAW pressures sensor. The pressure sensor apparatus can be alternatively based on other sensing technologies, such as silicon piezoresistive, ceramic capacitive and others.

Pressure sensor apparatus and method

A switch is made for use in elevated temperatures. A first stationary contact carrier is made of stainless steel and configured to be rigidly attached to a first stationary contact pad that is made of a nickel silver alloy. A second stationary contact pad of fine silver is used as the normally opened contact. A movable contact pad made of a silver cadmium oxide alloy is movable from a first position in contact with the normally closed first contact pad to a second position in contact with the normally opened second stationary contact pad.

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Rockford, IL, United States of America

Kundan L Malik