Samsung Electronics Co., Ltd.

Kundae Yeom

Jongho Lee

Yongkwan Lee

Hogeon Song

In one embodiment, the semiconductor module includes a module substrate and a first substrate mounted on and electrically connected to a first surface of the module substrate. The first substrate has one or more first electrical connectors of the semiconductor module, and the first substrate electrically connecting the first electrical connector to the module substrate.

Semiconductor module adapted to be inserted into connector of external device

Disclosed are semiconductor devices and methods of manufacturing the same. The semiconductor device includes an interposer and a first semiconductor package comprising a first substrate, and a first semiconductor chip mounted on the first substrate. The device also includes at least two second semiconductor packages electrically connected to a top surface of the interposer, the second semiconductor packages spaced apart from each other in a direction parallel to the top surface of the interposer. Each of the second semiconductor packages comprises a second substrate, a second semiconductor chip mounted on the second substrate and a mold part disposed on the second substrate to protect the second semiconductor chip.

Growing community of inventors

Asan-si, South Korea

Kundae Yeom