Samsung Electronics Co., Ltd.

Kun-Up Kim

Chang-Sik Kim

Doo-Seon Lee

Tae-Sik Son

Jong-hyoung Lim

In an embodiment, a semiconductor device is tested using a probe pad that includes a probing region with which a probe needle makes contact, and a sensing region bordering an edge of the probing region. Electrical signals are applied, and measured results indicate the probe needle's location relative to a test position on the semiconductor device.

Probe pad, substrate having a semiconductor device, method of testing a semiconductor device and tester for testing a semiconductor device

A probe sensing pad used to detect a position of a probe needle includes a probe area, at least two sensing regions contacting peripheral portions of the probe area, sensing elements of different electrical characteristics connected to corresponding sensing regions, and at least one isolation region for electrically insulting the sensing regions. The position of the probe needle relative to the probe sensing pad may be rapidly detected and automatically corrected toward a desired contact site of the probe sensing pad depending upon the voltage measured by a probe needle contacting the probe sensing pad. That is, the measured voltage will have a first value if deflected in a first direction, a second value (different from the first) if deflected in a second direction, and so on. The position of the probe needle can be corrected based on this measurement.

Growing community of inventors

Gyeonggi-do, South Korea

Kun-Up Kim