Mediatek Corporation

Kun-Ting Hung

Wen-Sung Hsu

Tai-Yu Chen

Nan-Cheng Chen

Che-Ya Chou

Shih-Chin Lin

Chia-Hao Yang

Bo-Jiun Yang

A semiconductor device includes a bottom package, a top package stacked on the bottom package, and an interposer disposed between the bottom package and the top package. The top package is electrically connected to the interposer through a plurality of peripheral solder balls. At least a dummy thermal feature is disposed on the interposer and surrounded by the plurality of peripheral solder balls.

Semiconductor device with dummy thermal features on interposer

A semiconductor package is provided. The semiconductor package includes a carrier substrate having opposite first surface and second surface, and a chip stack disposed on the first surface of the carrier substrate. The chip stack includes a first semiconductor die, a second semiconductor die, and an interposer between the first semiconductor die and the second semiconductor die. The interposer transmits signals between the first semiconductor die and the second semiconductor die.

Semiconductor package incorporating redistribution layer interposer

Growing community of inventors

Hsinchu, Taiwan

Kun-Ting Hung