Samsung Electronics Co., Ltd.

Kun-mo Chu

Yoon-chul Son

Min-jong Bae

Dong-earn Kim

Sung-hoon Park

Dong-ouk Kim

Sang-Eui Lee

Ha-Jin Kim

In-Taek Han

Ha-jin Kim

Sang-eui Lee

A heating member for a fusing apparatus includes a resistive heating layer including a base polymer and an electroconductive filler dispersed in the base polymer, where the resistive heating layer generates heat by receiving electric energy, and where a storage modulus of the resistive heating layer is about 1.0 megapascal or greater.

Heating member and fusing apparatus including the same

A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.

Resistance heating composition, heating composite using the composition, method of preparing the heating composite, and heating apparatus and fusing apparatus using the same

A resistance heating element includes a positive temperature coefficient resistance heating layer having a positive temperature coefficient, and a negative temperature coefficient resistance heating layer, which is connected to the positive temperature coefficient resistance heating layer and has a negative temperature coefficient.

Resistance heating element and heating member and fusing device employing the same

A heating member includes: a resistive heating layer which generates heat when supplied with electrical energy; a release layer as an outermost layer of the heating member and including a polymer; an intermediate layer disposed between the resistive heating layer and the release layer. The resistive heating layer includes a base polymer, and an electroconductive filler dispersed in the base polymer. The intermediate layer includes a polymer material being a same type as the base polymer of the resistive heating layer or the polymer of the release layer.

Heating member including a base polymer and fusing apparatus including the same

A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.

Method of forming thin resistive heating layer, heating member including the thin resistive heating layer, and fusing unit including the heating member

A heating member includes: a resistive heating layer including: a medium-passing area, and non-medium-passing areas respectively on opposing sides of the medium-passing area at opposing side portions of the resistive heating layer; a core which supports the resistive heating layer; a thermally conductive layer between the resistive heating layer and the core, and disposed in a non-medium passing area at a side portion of the resistive heating layer; and an electrode which is between the resistive heating layer and the core, contacts the side portion of the resistive heating layer and supplies current to the resistive heating layer. A ratio of a contact area between the thermally conductive layer and the resistive heating layer to an area of the non-medium-passing area in which the thermally conductive layer is disposed, ranges from about 5% to about 25%.

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Seoul, South Korea

Kun-mo Chu