Huawei Technologies Co., Limited

Boe Technology Group Co., Ltd.

Chengdu Boe Optoelectronics Technology Co., Ltd.

Hefei Boe Optoelectronics Technology Co., Ltd.

Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Cambridge Enterprise Limited

Hon Hai Precision Industry Co., Ltd.

Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd.

Jaguar Land Rover Limited

Samsung Electronics Co., Ltd.

Lenovo (Beijing) Limited

Honor Device Co., Ltd.

Beijing Dajia Internet Information Technology Co., Ltd.

Beijing Lenovo Software Ltd.

The Hong Kong Polytechnic University

Kun Li

Shin-Wen Chen

Long-Fei Zhang

Xiao-Mei Ma

Yu-Shuai Li

Daping Chu

Ding-Nan Huang

Li Qin Shen

Jian-Chao Song

Songping Yao

Bangshi Yin

Meng Cai

Tao Ma

Dayu Zhang

Jun-Hui Wang

Robert Hardy

Ke-Hua Fan

Bao Lu

Minghua Xuan

Yu Liu

Feng Bai

Yi Chen

Jing-Wei Li

Young Yik Ko

Bin Wu

Yifei Zhan

Jianlin Zhou

Yingwei Li

Hongli Jiang

Shancai Zhang

Yueyuan Zhang

Jinfang Zhang

Youngyik Ko

Hao Long

Sheng-Jie Ding

Dong Xu

Shui Liu

Lei Fan

Wei Pang

Jiong Zhou

Qiao Sun

Hewei Liu

Silei Huyan

Zhiqin Zhang

Nengyi Pan

Wei Wang

Lei Zhang

Jing Wang

Chao Li

Zheng-Heng Sun

Yu Wang

Fei Yang

Lei Liu

Xiaodong Yu

Yun Qiu

Wei Zhou

Wei Zhu

Yun Zhang

Yi Tong Wang

Rui Guo Zhang

Min Yan

Chang Zhang

An-Gang Liang

Xing Hu

Limin Dong

Xin Xiao

Fengzhen Lv

Hui Sun

Zhe Zhang

Li-Ren Fu

Xin Luo

Guoliang Li

Shiyi Cao

Shimin Zou

Chao Lv

Min Ye

Guanglei Yang

Chien-Ming Lee

Yuanming Feng

Ni Jiang

Yang Cao

Jun Cai

Yanxing Luo

Chunhua Wang

Huaping Qing

Zihuan Chen

Jie Cao

Rui Lyu

Shuai-Peng Li

Jin Hu

Zhiyun Chen

Ye-Quang Chen

Yuting Yang

Ping-Chuan Deng

Teng Ma

Ai-Ling He

Xi Xiang

Ho-Kai Liang

Jingang Zhang

Han-Bing Zhang

This disclosure provides a radio frequency chip, a signal transceiver, and a communication device. The radio frequency chip includes: a chip; a coupling structure, including: a resonator, where a resonant cavity is formed, and an inner wall of the resonant cavity is made of metal; a redistribution layer, arranged above the resonant cavity and including an redistribution layer (RDL) dielectric layer; a radiator, made of metal, formed into a centro-symmetric shape, arranged on a surface that is of the dielectric layer and that faces the resonator, and accommodated in the resonant cavity; a feeder, where one end of the feeder is connected to the chip, and the other end is inserted into the resonant cavity; a packaging structure, configured to package the chip and cover the redistribution layer, so that a signal generated by the chip can be efficiently coupled to a polymer transmission line.

Radio frequency chip, signal transceiver, and communication device

A dust collecting and blocking member with an aperture for a camera module, includes a frame body and an adhesive connected to the frame body. The frame body includes a first surface and a second surface opposites to the first surface, the aperture penetrates the first surface and the second surface, the first surface is recessed inwardly to form an annular groove, the annular groove circles the aperture. The adhesive is disposed inside the annular groove, and the frame body and adhesive function together to block trap and hold any dust present during manufacture of the camera module, to avoid an image quality which is less than optimal.

Dust collecting and blocking member, camera module with member, and electronic device with camera module

The present disclosure describes a terahertz carrier sending apparatus and a terahertz carrier receiving apparatus. The sending apparatus includes a radio frequency sending chip, a mode conversion structure, a terahertz transmission line, and a circuit board. The radio frequency sending chip is packaged on the circuit board, and includes a radio frequency sending circuit, a feed transmission line, and a mode excitation structure. The mode conversion structure includes a metal inner wall, configured to couple a terahertz signal excited by the mode excitation structure into the terahertz transmission line. The terahertz transmission line is configured to transmit the terahertz signal. The receiving apparatus includes a similar part in a receiving direction. The subject matter herein implements efficient electromagnetic coupling and improves data transmission bandwidth.

Terahertz carrier sending apparatus and terahertz carrier receiving apparatus

A lens module with light-passing hole which is finely adjustable in size includes a lens and aperture assembly. The aperture assembly includes cover body, driving member, rotating disk, and light-blocking blades. The cover body is outside the lens and defines a first aperture. The rotating disk is on the cover body and defines a second and adjustable aperture. The blades are between the cover body and rotating disk, each blade comprising a side surface and the plurality of blades work together to form a light-passing hole. The rotating disk is driven to rotate by the driving member, the blades thereby moving closer to or away from each other, to adjust an aperture of the lens module. The present disclosure further provides an electronic device.

Lens module with finely-adjustable aperture and electronic device

A dustproof member includes a base plate, a dustproof plate, and a connecting portion. A first through hole is defined by an inner surface of the base plate. A second through hole is defined by an inner surface of the dustproof plate. The connecting portion has a shape of a hollow barrel and defines a hollow cavity. Two opposite ends of the connecting portion are respectively connected to an end of the inner surface of the base plate and an end of the inner surface of the dustproof plate, thereby forming a dust collecting groove between the base plate and the dustproof plate. A camera module having the dustproof member and an electronic device having the camera module are also provided.

Dustproof member, camera module having the dustproof member and electronic device having the camera module

A carrying frame includes a main body, a first rotating part, a second rotating part, and a driving part. The main body includes a first inner surface which defines a first through hole. The first rotating part is mounted on the first inner surface and comprises a second inner surface which defines a second through hole. The second rotating part is mounted on the second inner surface and comprises a third through hole. The driving part is configured to drive at least one of the first rotating part to rotate in a first direction and the second rotating part to rotate in a second direction. The first direction and the second direction are perpendicular to each other, and both the first direction and the second direction are parallel to a plane where the main body is located. A camera module and an electronic device are also provided.

Image resolution enhancing carrying frame, camera module and electronic device

A lens module includes a lens assembly, a voice coil motor, a bracket, a circuit board, and a solder block. The voice coil motor includes a pin. The lens assembly is received in the voice coil motor. The bracket is disposed on the voice coil motor. The pin is extending into the recessed area. The bracket is sandwiched between the voice coil motor and the circuit board. The circuit board includes conductive supporting blocks facing the voice coil motor. The conductive supporting blocks are disposed in the recessed area. And one pin and one conductive supporting block are electrically connected by the solder block. The present disclosure also provides an electronic device including the lens module.

Lens module having a voice coil motor and electronic device

An impact- and vibration-proof lens module includes a fixing assembly, a circuit board, a lens assembly, and a buffering pad. The fixing assembly defines a chamber, and the circuit board is partially disposed in the chamber. The lens assembly is disposed on the circuit board, and the lens assembly is also partially disposed in the chamber. The buffering pad made of thermally conductive silicon is disposed in the chamber and is disposed between the circuit board and the fixing assembly. In the event of being dropped or suffering vibration, the buffering pad disperses and absorbs stress on the fixing assembly to prevent breakage.

Impact-protected lens module with buffering pad and electronic device

A camera module includes a circuit board, a lens assembly, and a first board. The circuit board includes a first surface, a second surface opposite to the first surface, a first sidewall, and a second sidewall opposite to the first sidewall. Each of the first sidewall and the second sidewall connects the first surface to the second surface. The lens assembly is disposed on the first surface. The first board is connected to the first sidewall. The first board is inclined or perpendicular to the first surface. The first board is disposed on a side of the lens assembly.

Camera module with reduced width and electronic device having the same

Display screen with an adjustable post-type support and circular base

A simple and integrated imaging device for housing motor-switchable and laterally-moving filters between a camera-lens holder and an imaging chip comprises the switchable filters in a cavity and a switching mechanism, and a driving mechanism are also in the cavity. The imaging chip is carried by a flexible printed circuit board. The driving mechanism connected to the switching mechanism drives the switching mechanism to slide back and forth underneath the camera-lens holder, so that either the first or the second switchable filter covers a through hole allowing light to fall on the imaging chip. An electronic device including the imaging device is also disclosed.

Imaging device with switchable filters and electronic device having the imaging device

A zoom lens assembly for periscope use which is effectively soundless in operation includes a lens barrel defined with a through hole, a plurality of optical lenses disposed within the through hole, and a focusing member disposed between any two of the plurality of optical lenses. The focusing member in a camera module includes a bottom plate, a cover plate, a piezoelectric element, and a variable transparent body. The variable transparent body is between the bottom plate and the cover plate, the piezoelectric element is disposed on a surface of the cover plate that faces away from the variable transparent body. Electricity fed to the piezoelectric element causes movement of the element which deforms the variable transparent body and changes the focal length of the camera module.

Zoom lens assembly soundless in operation, camera module having zoom lens assembly, and electronic device having camera module

An iOS application program construction method and an apparatus, and electronic devices, and a storage medium are provided. The iOS application program construction method includes: configuring project information; based on the project information and at least one target component, utilizing a compilation management service and employing a script to configure a preset project, so as to obtain a target project; and packaging the target project by utilizing a packaging system to obtain an iOS application program corresponding to the target project.

iOS application program construction method and apparatus, electronic device, and storage medium

A photosensitive assembly includes a circuit board. The circuit board has a first surface, a second surface opposite to the first surface, and a first through hole extending through the first surface and the second surface. A photosensitive chip is disposed on the second surface. The photosensitive chip has a photosensitive area and a non-photosensitive area connected to the photosensitive area, the non-photosensitive area is electrically connected to one side of the second surface, and the photosensitive area is exposed from the first through hole. A reinforcing plate is disposed on the first surface. A thermal conductive layer is disposed on the photosensitive chip, and the thermal conductive layer includes a silica gel or a metal.

Camera module having circuit board with imrpoved flatness and electronic device

A radiator sharing antenna and mobile terminal including the radiator sharing antenna includes a radiator divided into a first sub-radiator and a second sub-radiator by a gap, a first feeding point, and a second feeding point. A radio frequency signal is fed through the first feeding point on the first sub-radiator, and a radio frequency signal is fed through the second feeding point on the second sub-radiator. The radiator sharing antenna is adapted to generate a plurality of antenna operating bands through the resonance generated by the first sub-radiator and the second sub-radiator and the parasitic resonance generated through mutual influence between the first sub-radiator and the second sub-radiator.

Radiator sharing antenna and electronic device

Growing community of inventors

Guangdong, China

Kun Li