United Microelectronics Corp.

Kun-Ju Li

Fu-Shou Tsai

Yu-Ting Li

Po-Cheng Huang

Chun-Tsen Lu

Li-Chieh Hsu

Bin-Siang Tsai

Fu-Yu Tsai

Tai-Cheng Hou

Chih-Yueh Li

Hsin-Jung Liu

Chau-Chung Hou

Yi-Liang Liu

Ang Chan

Yu-Lung Shih

Chen-Yi Weng

Jing-Yin Jhang

Chih-Hsun Lin

Wei-Xin Gao

Hui-Lin Wang

Chun-Lung Chen

Yu-Tsung Lai

Kun-Yuan Liao

Chia-Lin Lu

Chin-Yang Hsieh

Wei-Hao Huang

Wen-Chin Lin

Wu-Sian Sie

Kuo-Chin Hung

Ji-Min Lin

Yi-Han Liao

Chih-Chien Liu

Yu-Ping Wang

Ching-Wen Hung

Chen-Ming Huang

Chien-Ming Lai

Min-Chuan Tsai

Ya-Huei Tsai

Wei-Chuan Tsai

Jen-Chieh Lin

Yang-Ju Lu

Chun-Han Chen

Lu-Sheng Chou

Yu-Tung Hsiao

Chien-Nan Lin

Ching-Hsiang Chiu

Jhih-Yuan Chen

Ching-Yang Chuang

I-Lun Hung

Yong-Yi Lin

Yi-Wei Chen

Chun-Yuan Wu

Rung-Yuan Lee

Wei-Jen Wu

Chang-Hung Kung

I-Ming Lai

Tzu-Hsiang Hung

Jia-Feng Fang

Chun-Liang Liu

Shih-Ming Lin

Fu-Chun Hsiao

Lan-Ping Chang

Yue-Han Wu

Zong-Sian Wu

A method for fabricating semiconductor device includes the steps of: forming a first magnetic tunneling junction (MTJ) on a substrate; forming a first ultra low-k (ULK) dielectric layer on the first MTJ; performing a first etching process to remove part of the first ULK dielectric layer and form a damaged layer on the first ULK dielectric layer; and forming a second ULK dielectric layer on the damaged layer.

Semiconductor device and method for fabricating the same

A semiconductor device includes a first magnetic tunneling junction (MTJ) and a second MTJ on a substrate, a first ultra low-k (ULK) dielectric layer on the first MTJ and the second MTJ, a passivation layer on the first ULK dielectric layer, and a second ULK dielectric layer on the passivation layer. Preferably, the first ULK dielectric layer includes a first thickness, the passivation layer between the first MTJ and the second MTJ includes a second thickness, the passivation layer on top of the first MTJ includes a third thickness, and the second thickness is greater than the third thickness

Magnetoresistive random access memory and method for fabricating the same

A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Method for manufacturing semiconductor device

A method for fabricating semiconductor device includes first forming a first magnetic tunneling junction (MTJ) and a second MTJ on a substrate, performing an atomic layer deposition (ALD) process or a high-density plasma (HDP) process to form a passivation layer on the first MTJ and the second MTJ, performing an etching process to remove the passivation layer adjacent to the first MTJ and the second MTJ, and then forming an ultra low-k (ULK) dielectric layer on the passivation layer.

A semiconductor device includes a first magnetic tunneling junction (MTJ) and a second MTJ on a substrate, a passivation layer on the first MTJ and the second MTJ, and an ultra low-k (ULK) dielectric layer on the passivation layer. Preferably, a top surface of the passivation layer between the first MTJ and the second MTJ is lower than a top surface of the passivation layer directly on top of the first MTJ.

Magnetoresistive random access memory (MRAM) device

A method for fabricating semiconductor device includes the steps of: forming a first magnetic tunneling junction (MTJ) on a substrate; forming a first ultra low-k (ULK) dielectric layer on the first MTJ; performing a first etching process to remove part of the first ULK dielectric layer and forming a damaged layer on the first ULK dielectric layer; and forming a second ULK dielectric layer on the damaged layer.

Method of manufacturing magnetoresistive random access memory (MRAM) device

A method for fabricating semiconductor device includes the steps of: forming a first magnetic tunneling junction (MTJ) and a second MTJ on a substrate; forming a first top electrode on the first MTJ and a second top electrode on the second MTJ; forming a first ultra low-k (ULK) dielectric layer on the first MTJ and the second MTJ; forming a passivation layer on the first ULK dielectric layer, wherein a bottom surface of the passivation layer between the first MTJ and the second MTJ is lower than a top surface of the first MTJ; and forming a second ULK dielectric layer on the passivation layer.

A semiconductor substrate is provided. The semiconductor substrate has thereon a first dielectric layer, at least one conductive pattern disposed in the first dielectric layer, and a second dielectric layer covering the first dielectric layer and the at least one conductive pattern. A via opening is formed in the second dielectric layer. The via opening exposes a portion of the at least one conductive pattern. A polish stop layer is conformally deposited on the second dielectric layer and within the via opening. A barrier layer is conformally deposited on the polish stop layer. A tungsten layer is conformally deposited on the barrier layer. The tungsten layer and the barrier layer are polished until the polish stop layer on the second dielectric layer is exposed, thereby forming a via plug in the via opening. A bottom electrode layer is conformally deposited on the second dielectric layer and the via plug.

Method for fabricating a semiconductor device

A fabricating method of transistors includes providing a substrate with numerous transistors thereon. Each of the transistors includes a gate structure. A gap is disposed between gate structures adjacent to each other. Later, a protective layer and a first dielectric layer are formed in sequence to cover the substrate and the transistors and to fill in the gap. Next, numerous buffering particles are formed to contact the first dielectric layer. The buffering particles do not contact each other. Subsequently, a second dielectric layer is formed to cover the buffering particles. After that, a first planarization process is performed to remove part of the first dielectric layer, part of the second dielectric layer and buffering particles by taking the protective layer as a stop layer, wherein a removing rate of the second dielectric layer is greater than a removing rate of the buffering particles during the first planarization process.

Fabricating method of transistors without dishing occurred during CMP process

The present invention discloses a metal gate process. A sacrificial nitride layer is introduced during the fabrication of metal gates. The gate height can be well controlled by introducing the sacrificial nitride layer. Further, the particle fall-on problem can be effectively solved.

Method of manufacturing a semiconductor device

An alignment mark structure includes a dielectric layer. A trench is embedded in the dielectric layer. An alignment mark fills up the trench, wherein the alignment mark includes a metal layer covering the trench. A first material layer covers and contacts the metal layer. A second material layer covers and contacts the first material layer. A third material layer covers and contacts the second material layer. The first material layer, the second material layer, and the third material layer independently includes silicon nitride, silicon oxide, tantalum-containing material, aluminum-containing material, titanium-containing material, or a low-k dielectric having a dielectric constant smaller than 2.7, and a reflectance of the first material layer is larger than a reflectance of the second material layer, the reflectance of the second material layer is larger than a reflectance of the third material layer.

Alignment mark structure and method of fabricating the same

A method for manufacturing a memory device is provided, the method includes the following steps: firstly, providing a dielectric layer, then simultaneously forming a contact window and an alignment mark trench in the dielectric layer, wherein the contact window exposes a lower metal line, then forming a conductive layer on the surface of the dielectric layer, in the contact window and in the alignment mark trench, performing a planarization step on the conductive layer, and leaving a residue in the alignment mark trench. Subsequently, a nitrogen plasma step (Nplasma) is performed on the dielectric layer, a cleaning step is performed to remove the residue in the alignment mark trench, and a patterned magnetic tunneling junction, MTJ) film is laminated on the contact window.

Manufacturing method of memory device

The present invention provides a wafer polishing pad, the wafer polishing pad includes a polishing material layer, a plurality of recesses are formed on the top surface of the polishing material layer, and a warning element disposed within the polishing material layer, the warning element and the polishing material layer have different colors. The feature of the invention is that forming a warning element in the polishing material layer, when the visible state of the warning element is changed, for example, when the warning element appears, disappears or changes the shapes, it means that the wafer polishing pad needs to be replaced. In this way, the user can confirm the destroying situation of the wafer polishing pad easily, and also improving the manufacturing process efficiency.

Wafer polishing pad and using method thereof

Growing community of inventors

Tainan, Taiwan

Kun-Ju Li