Delta Electronics, Inc.

China Unionpay Co., Ltd.

Shanghai Lyocell Fibre Development Co., Ltd.

Kun Jiang

Jianxin Chen

Xin Wang

Quansong Luo

Xi Liu

Jinyao Xu

Chunhuan Li

Tao Hai

Chunye Hui

Tianshu Ma

Xiaoliang Wang

Fengjun Liu

Changli Zhu

Dianhai Zheng

Linrun Ding

Geguo Men

A power module and a manufacturing method are provided. The power module includes a first electronic assembly and a second electronic assembly. The first electronic assembly includes at least one pin. The second electronic assembly includes a first surface and a second surface opposite to each other. The first surface is more adjacent to the first electronic assembly than the second surface. A direction from the first surface toward the second surface is defined as a reference direction. The second electronic assembly includes a first region and a second region. The first region has a first thickness in the reference direction. The second region has a second thickness in the reference direction. The second thickness is less than the first thickness. The second region includes at least one through hole. The pin is penetrated through the at least one through hole and fixed on the second electronic assembly.

Power module and manufacturing method thereof

The present disclosure is related to an electronic module assembly structure including a system board, an electronic module and an adhesive material. The system board includes a first upper surface and a first lower surface opposite to each other. The electronic module spatially corresponds to the first upper surface and includes plurality leading pins and a carrier. Each leading pin has a soldering surface and is connected to the first upper surface through a first reflow soldering process. When the plurality leading pins are connected to the first upper surface, a height difference is formed between the carrying surface of the carrier and the soldering surfaces. The adhesive material is disposed on the carrying surface or the first upper surface. The carrier is connected with the first upper surface through the adhesive material, so that the electronic module is fixed to the first upper surface through the adhesive material.

Electronic module assembly structure

The present invention discloses a device and method for security information interaction. The device for security information interaction includes: an interface circuit, configured to connect the device for security information interaction to an internet terminal; an information input unit, configured to allow user to input security information; a secure encryption/decryption unit, configured to store and process the security information; an information reader, configured to read information data from an external information carrier; wherein the secure encryption/decryption unit processes the security information in connection with the information data, and complete a business function on the secure channel through the interaction with the security information processing server. The device and method for security information interaction disclosed in the present invention improves the flexibility and efficiency of the information processing system, enhances the security of the information processing system, and extending new applications of an external information carrier in an open network environment.

Internet based security information interaction apparatus and method

A solvent spun bamboo fiber with a high wet modulus and a producing method thereof are disclosed. The producing method includes: activating by adding a bamboo pulp into de-ionized water, adjusting the pH value, adding cellulase and adjusting the pH value by adding alkali; squeezing by vacuum dehydration; pre-dissolving by adding an aqueous solution containing 50-88% by mass of N-methylmorpholine-N-oxide; then dissolving by putting the above pre-dissolved mixture into a dissolver, heating, vacuumizing, dehydrating, dissolving, homogenizing and defoaming; spinning by spraying through a spinneret and forming a bamboo fiber by dry-wet spinning; water washing; bleaching; oiling; and drying. The present method is simple to operate, free of industrial pollution, low energy consuming, and highly safe. The bamboo fiber produced by the present method not only keeps the natural physical and chemical properties of bamboo fiber, but also has a high wet modulus without harmful chemical residues.

Solvent spun bamboo fiber with high wet modulus and producing method thereof

Growing community of inventors

Shanghai, China

Kun Jiang