Altus Technology Inc.

Kun-Hsieh Liu

Ying-Cheng Wu

Steven Webster

Po-Chih Hsu

A digital camera module packaging method includes: first, providing a carrier () including a base () defining a chamber () and a lead frame (). The lead frame has a plurality of conduction pieces () embedded in the base. One end of each conduction piece is exposed at one surface of the base, and another end of the conduction piece is exposed at another surface of the base. An image sensor chip () with a photosensitive area () and a plurality of chip pads () is then mounted in the chamber. A plurality of wires () is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one exposed end of a corresponding conduction piece of the carrier. A holder () is then provided. The carrier is mounted to the holder. Finally, a lens module () is mounted on the holder.

Digital camera module packaging method

A digital camera module () includes a lens holder (), a lens module () received in the lens holder, and an image sensor chip package () mounted to the lens holder. The lens module includes a lens barrel () movably engaged in the lens holder and at least one lens () received in the lens barrel. The image sensor chip package includes a base (), an image sensor chip () mounted on the base, a transparent cover (), and an adhesive () positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.

Digital camera module with small sized image sensor chip package

An image sensor chip packaging method includes: first, providing a carrier (). The carrier includes a base () and a lead frame (). The base has a chamber () defined therein. The lead frame has a plurality of conduction pieces (). The conduction pieces of the lead frame are embedded in the base and are spaced from each other. An image sensor chip () is then mounted in the chamber. The image sensor has a photosensitive area () and a plurality of chip pads (). A plurality of bonding wires () is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one of the exposed ends of a corresponding conduction piece of the carrier. A holder () having a holding cavity () is then provided. Finally, the carrier is then mounted in the holding cavity of the holder.

Image sensor chip packaging method

An image sensor package method includes the steps of: first, providing a carrier (), which includes a base () and a leadframe (). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an image sensor chip on the base and received in the cavity, the image sensor having a photosensitive area. Third, providing a plurality of wires, each electrically connects the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourth, applying an adhesive means around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover on the carrier, where an adhesive means fixes the cover in place.

Image sensor chip package fabrication method

A digital still camera module includes an image sensor package () and a lens barrel () mounted on the image sensor package. The image sensor package includes a substrate (), an image sensor chip (), and a cover (). The substrate defines a receiving chamber () therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section () at a periphery of the cover. The lens barrel includes at least one lens () received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.

Digital still camera module

An IC (integrated circuit) chip package includes a substrate (), a chip (), a plurality of bonding wires (), and a cover (). The substrate has a top surface, a bottom surface, a receiving chamber () defined therein, a plurality of solder pads () arranged around the top surface and the bottom surface, and a plurality of vias () having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.

IC chip package with cover

An IC chip package includes a substrate (), a chip (), a plurality of bonding wires (), and a cover (). The substrate has a top surface, a receiving chamber () having an opening at the top surface, a plurality of solder pads () arranged around the top surface and respectively corresponding to the solder pads arranged at a bottom surface opposite to the top surface, and a plurality of vias () having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads () arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate, and covers the opening.

IC chip package with isolated vias

A digital camera module package method includes the steps of: firstly, providing a carrier (), which includes a base () and a leadframe (). The base has a cavity therein and the leadframe includes a number of conductive pieces (); Secondly, mounting an image sensor chip () on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means () around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover () on the carrier, where an adhesive means fixes the cover in place.

Growing community of inventors

Miao-Li, Taiwan

Kun-Hsieh Liu