Taiwan Semiconductor Manufacturing Comp. Ltd.

Kun Da Jhong

Ling-Sung Wang

Chen-Chieh Chiang

Hsueh-Han Lu

Kun-ei Chen

Pei-lum Ma

A semiconductor structure is provided. The semiconductor structure includes an interconnection structure, a first conductive pad, a second conductive pad, a conductive material and a conductive coil. The first and second conductive pads are disposed over and electrically connected to the interconnection structure individually. The conductive material is electrically isolated from the interconnection structure, wherein bottom surfaces of the conductive material, the first conductive pad and the second conductive pad are substantially aligned. The conductive coil is disposed in the interconnection structure and overlapped by the conductive material. A manufacturing method of a semiconductor structure is also provided.

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Tainan, Taiwan

Kun Da Jhong