Industrial Technology Research Institute

Darwin Precisions Corporation

Briview Corporation

Kun-Chih Pan

Chih-Wei Chen

Min-Chieh Chou

Horng-Jee Wang

Jyh-Chun Chang

Jen-Shun Lin

Ya-Ju Huang

Bai-Chen Chang

Heng-Chun Huang

Jauh-Jung Yang

Ming-Yueh Liu

Chien-Hung Lai

Ching-Yuan Hu

Ching-Feng Li

Jiu-Shu Tasi

Kuan-Tao Tsai

Chia-Hsu Tu

Chu-Shu Tsai

A metal mask manufacturing method includes: (a) disposing a first anti-etching layer having a first void region on a first face of a substrate; (b) disposing a second anti-etching layer on a second face of the substrate opposite to the first face, wherein a second void region of the second anti-etching layer is corresponding to the first void region; (c) performing a first etching on the first face and the second face to form a first concave part and a second concave part separated by a part of the substrate; (d) disposing a protecting layer filled into the first concave part; (e) performing a second etching from the second face to produce a void between the first concave part and the second concave part; (f) removing the second anti-etching layer; and (g) performing a third etching from the second face.

Metal mask manufacturing method and metal mask

A light guide plate and a manufacturing method thereof are disclosed. The light guide plate includes a substrate, a screen-printed layer, and a light-solidified layer. The substrate has a first surface and a second surface, and the first surface and the second surface are opposite. The screen-printed layer is formed on the first surface of the substrate by a screen-printing process. The light-solidified layer is formed on the second surface of the substrate by a light-solidification and imprinting process. The screen-printed layer has a plurality of screen point patterns. The light-solidified layer has a plurality of micro-structures.

Light guide plate and manufacturing method thereof

A light guide plate and manufacture methods thereof are provided. The light guide plate includes a plate body, an optical adhesive layer, and a light entrance structure layer. The plate body has a light exit surface and a light entrance surface. The light entrance surface is connected to a side of the light exit surface and intersects the light exit surface with an angle. The optical adhesive layer is attached on the light entrance surface while the light entrance structure layer is attached to the optical adhesive layer. The light entrance structure layer includes a substrate and a light-cured or thermal-cured structure. The light-cured or thermal-cured structure is made of light or thermal curable material and firmly formed on a structured surface of the substrate through a light or thermal curing process.

Light guide plate with light entrance structure and manufacture method for manufacturing the same

A probe module which is particularly suitable for testing an LCD panel. The probe module includes a probe base, a plurality of probe pins provided on the probe base, and a high-density circuit interconnection which includes a flexible circuit board that connects the probe pins to a testing apparatus. The tip of each probe pin may have a pointed or tapered configuration, or alternatively, a hemi-spherical configuration.

Integrated probe module for LCD panel light inspection

An integrated type probe card includes a circuit space converter having first and second contacts arranged at different density at two sides, probes connected to the contacts at one side of the circuit space converter that are arranged at a high density probes; a spring connector plate, which holds metal spring members in respective receiving holes thereof, a circuit board pressed on the metal spring members against the contacts at the other side of the circuit space converter that are arranged at a low density, and a level adjustment mechanism that accommodates the probes, the circuit space converter, the spring connector plate and the circuit board and enables the user to adjust the level status of the circuit space converter, keeping the circuit space converter electrically connected to the circuit board for transmitting test signal from the probes to the circuit board.

Integrated type probe card and its fabrication method

A method for manufacturing a 3-D high aspect-ratio microneedle array device, comprising steps of: providing a substrate, with a photoresist layer coated thereon; performing photolithography on the photoresist layer by using a gray-tone mask so as to form a patterned photoresist layer; performing high-selectivity etching on the patterned photoresist layer and the substrate by using inductively coupled plasma etching so as to transfer the pattern onto the substrate and form a structure; applying a material on the structure; and de-molding the structure from the substrate.

Method for manufacturing 3-D high aspect-ratio microneedle array device

Growing community of inventors

Taichung, Taiwan

Kun-Chih Pan