Senqcia Corporation

Hitachi Metals Techno, Ltd.

Sony Corporation

Kabushiki Kaisha Toshiba

Senqcia Co., Ltd.

Kumiko Masuda

Hideaki Takahashi

Hidenori Tanaka

Taku Tomita

Nobuyuki Sato

Koichi Endo

Michio Itoh

Goro Shiraishi

Haruki Arai

Hisatomo Mochiduki

Ikumi Hayashi

Chie Sekine

Kuniharu Mori

A column body () is, for example, an H steel column. Abase plate () is joined to the lower end of the column body (). Anchor bolts () are inserted into a foundation () and are fixed thereto. Slits (), () are provided in the base plate (). The slits (), () are formed in mutually different directions. The slits (), () are formed so as to surround the anchor bolts () (holes of the base plate ()). More specifically, the anchor bolts () are surrounded from a plurality of directions by the slits (), () formed in a plurality of different directions.

Column base structure for construction, and base plate

A cutout part is formed at the approximate center of the connecting member. The cutout part in the connecting member is a circular penetrating hole that penetrates a convex part and a main body part. On the side of a lower surface of the connecting member, the convex part is formed around the cutout part. The convex part includes a tapered part and a rib. The tapered part gradually inclines in the direction toward the center from the side of the main body part (the side of the base part of the convex part) to the tip side (the side of the top part thereof). The rib part is formed on the edge part of the cutout part, which is the top part of the tapered part. The rib part is a part that protrudes downward from the top part of the tapered part.

Connecting member for column and connection structure of column

Column base metal fitting

A column base fittingincludes a bottom platehaving an approximately square plate shape and a support baseinside from the peripheral part of an upper surfaceof the bottom plate. A first bolt insertion holesis formed in each four corner portions of the bottom plateand a second bolt insertion holeis formed at two positions closer to the center part than the first bolt insertion hole, in the length direction of each four sides of the bottom plate. A corner built-up portionis formed at both ends in the length direction of the side surfaceof the support base, having a shape protruding outward in the perpendicular direction from the side surfaceand filling the corner portion between the side surfaceand an upper surface of the bottom plate

Column base fitting and column base structure using it

A tempo analyzer to analyze the tempo of sound such as a musical composition or the like is provided in which a controller () takes, based on level information on a sound signal from an analysis data extraction unit (), a frame which is a predetermined unit-time interval as a unit of process, detects positions of peaks of the level of the sound signal (apex of the change in level) higher than a predetermined level to find a time interval (peak-to-peak interval) between the peak positions in the frame, and determines a peak-to-peak time interval having occurred frequently as a tempo.

Tempo analysis device and tempo analysis method

In an IC driver using SOI dielectric isolation structure having a lower and an upper arm side drivers, the upper arm side driver operates in a floating state, a carrier injector region is disposed in an semiconductor island where a switching device for the upper-side circuit is formed. The IC driver drives a set of an upper-side and a lower-side output power devices, a first main electrode of the upper-side output power device is connected to a high level power supply, a second main electrode of the upper-side output power device is connected to a first main electrode of the lower-side output power device, a second main electrode of the lower-side output power device is connected to ground potential (GND). The carrier injector region is formed deeper than a couple of main electrode regions of the switching device in the upper arm side driver. Moreover, this injector region is connected to an intermediate potential at connecting terminal of the upper-side and the lower-side output power devices. A current for compensating the displacement current J,flowing in the parasitic condenser C,inherent to the SOI structure is supplied through the carrier injector from this intermediate potential terminal, to diminish the extra load of the internal power supply circuit for supplying the upper arm side driver with a predetermined voltage.

Dielectrically isolated IC driver having upper-side and lower-side arm drivers and power IC having the same

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Tokyo, Japan

Kumiko Masuda