Other

Kumareson Darmalingam

Yeow Thiam Ooi

Prebesh Pavithran

Khen Ming Goh

A camera module including an image sensor and a circuit substrate that are each attached to a bottom surface of a glass substrate. The image sensor is positioned between the circuit substrate and the glass substrate. This arrangement allows passive components normally associated with the image sensor to be mounted to a top surface of the glass substrate rather than to the image sensor, thus reducing the necessary size of the top surface of the image sensor, which in turn can reduce the overall size of the image sensor. A lens assembly, including a housing and a lens, is attached to the circuit substrate to position the image sensor and the glass substrate within a cavity provided in the housing.

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Lengkok Angsana, Malaysia

Kumareson Darmalingam