Foster-miller, Inc.

Kumaraswamy Jayaraj

Richard W Lusignea

Paul J Glatkowski

Joseph W Piche

Harry F Lockwood

James M Burnett

Thomas E Noll

A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.

Chip packaging technique

This invention relates in general to capacitors including one or more layers of dielectric material wherein at least one of the layers including a multiaxially oriented lyotropic liquid crystalline polymer (LCP) film. The present invention also provides lyotropic LCPs films having less than 0.5% residual ionic contaminants and a method of preparing such films and capacitors including such films. In preferred embodiments, the invention further provides a capacitor wherein the liquid crystalline polymer film has less than 0.5% residual ionic contaminants.

Liquid crystalline polymer capacitors

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Foxboro, MA, United States of America

Kumaraswamy Jayaraj