Apple Inc.

Kumar Nagarajan

Flynn P Carson

Scott D Morrison

Karthik Shanmugam

Raymundo M Camenforte

Sidharth S Dalmia

Menglu Li

A radio frequency package includes a baseband processor, a transceiver, and a memory. The baseband processor performs processing for wireless communication functions. Moreover, the transceiver transmits and receives wireless signals based on the processing of the wireless communication functions. Additionally, the memory is associated with the baseband processor and stores instructions for performing the processing. The memory and the baseband processor are disposed on top of the transceiver.

System packaging for cellular modem and transceiver system of heterogeneous stacking

Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.

Molded silicon on passive package

Growing community of inventors

Cupertino, CA, United States of America

Kumar Nagarajan