Intel Corporation

Kumar Abhishek Singh

Debendra Mallik

Chia-Pin Chiu

Omkar G Karhade

Nitin A Deshpande

Sanka Ganesan

Ram S Viswanath

Mitul Bharat Modi

Edvin Cetegen

Yiqun Bai

Aastha Uppal

Jan Krajniak

Ravindranath Vithal Mahajan

James Chris Matayabas, Jr

Je-Young Chang

Robert M Nickerson

Manish Dubey

Xiaoqian Li

Weihua Tang

Kaveh Hosseini

Zhaozhi Li

Rees Winters

Thomas J Debonis

Marely E Tejeda Ferrari

Kevin P Ma

Thu Ngoc Tran

Yew Fatt Kok

Casey Thielen

An apparatus is provided which comprises: a package substrate, an integrated circuit device coupled to a surface of the package substrate, a first material on the surface of the package substrate, the first material contacting one or more lateral sides of the integrated circuit device, the first material extending at least to a surface of the integrated circuit device opposite the package substrate, two or more separate fins over a surface of the integrated circuit device, the two or more fins comprising a second material having a different composition than the first material, and a third material having a different composition than the second material, the third material over the surface of the integrated circuit device and between the two or more fins. Other embodiments are also disclosed and claimed.

Coupled cooling fins in ultra-small systems

An integrated circuit package may be formed having at least one heat dissipation structure within the integrated circuit package itself. In one embodiment, the integrated circuit package may include a substrate; at least one integrated circuit device, wherein the at least one integrated circuit device is electrically attached to the substrate; a mold material on the substrate and adjacent to the at least one integrated circuit device; and at least one heat dissipation structure contacting the at least one integrated circuit, wherein the at least one heat dissipation structure is embedded either within the mold material or between the mold material and the substrate.

Thermal management solutions for integrated circuit packages

Embodiments disclosed herein include an electronics package. In an embodiment, the electronics package comprises a package substrate and a die on the package substrate. In an embodiment, a mold layer is positioned over the package substrate. In an embodiment, the electronics package further comprises through-mold interconnects through the mold layer, and a trench that extends at least partially into the mold layer.

Micro-trenching mold interface in a pop package

Growing community of inventors

Phoenix, AZ, United States of America

Kumar Abhishek Singh