Robert Boschgmbh

Wolfspeed, Inc.

Akustica, Inc.

Kuldeep Saxena

Jay Scott Salmon

Devarajan Balaraman

Sayan Seal

Guy Moxey

A packaged electronic device comprises a power semiconductor die that comprises a first terminal and a second terminal, a lead frame comprising a lower side and an upper side that comprises a die pad region, a first lead and a second lead, wherein the first lead is integral with the lead frame and electrically connected to the first terminal of the power semiconductor die through the lead frame, a dielectric substrate, and a thermally conductive adhesion layer on an upper side of the dielectric substrate. The power semiconductor die is on the die pad region of the lead frame and the lead frame is on an upper side of the thermally conductive adhesion layer.

Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers

A power semiconductor package includes a power semiconductor die, a housing, a first lead, and a second lead. The housing includes a top side and a bottom side. The first lead is in contact with a first electrical contact of the power semiconductor die. Further, the first lead includes a heat exchanging portion on the top side of the housing and an electrical contact portion on the bottom side of the housing. At least 7.5 mmof the electrical contact portion of the first lead is available for contacting a printed circuit board. The second lead is in contact with a second electrical contact of the power semiconductor die. The second lead includes a heat exchanging portion on the bottom side of the housing and an electrical contact portion also on the bottom side of the housing.

Power semiconductor package with improved performance

Power semiconductor package

A MEMS device package assembly for encapsulating one or more internal components includes a first MEMS device package. The first package includes a cover and a substrate attached to the cover by any suitable methods of attachment. A corrugated structure is formed on at least one of an inner or outer wall of the cover. The assembly further includes a second MEMS device package having a cover, a substrate, and a corrugated structured formed on at least one of an inner or outer wall of the cover. The first and second MEMS device packages may be coupled to the same substrate or different substrate. In another embodiment, the first MEMS device package may be mounted on the second MEMS device package. In yet another embodiment, the first MEMS device package may be contained in the second MEMS device package.

Corrugated package for microelectromechanical system (MEMS) device

A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.

Microphone package with molded spacer

A microelectromechanical system (MEMS) device package for encapsulating a MEMS device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the MEMS device package and is adapted to route electrical connections from the MEMS device to either the substrate or a second MEMS device package via the substrate.

Growing community of inventors

Sewickley, PA, United States of America

Kuldeep Saxena