Hyundai Motor Company

Snu Rdb Foundation

Samsung Electronics Co., Ltd.

Kia Motors Corporation

Kuk-jin Chun

Jin Ha Lee

Sera Lim

Kyoung Doug Min

Seounghyeon Lee

In-sang Song

Chul-soo Kim

Duck-hwan Kim

Jong-Hyuk Kim

Junyong Lee

Young Jae Kim

Sung-Chan Kang

Sehwan Kim

Jae-Shik Shin

A particulate matter sensor unit may include a sensor portion of an electrostatic induction type that may be reacted when a particulate matter having electric charge may be passing the vicinity thereof, a protection pad that the sensor portion may be bonded on one side thereof through a conductive paste, an heater electrode that may be formed on the protection pad and burns the particulate matters that may be disposed on the sensor portion to eliminate them, and a sensor electrode that may be formed on the protection pad to transfer a signal that may be generated by the sensor portion to an outside.

Particulate matter sensor unit

A particulate matter sensor unit including a sensor on one side of an exhaust line and configured to employ an electrostatic induction for generating electric charges by a particulate matter contained in an exhaust gas when the particulate matter passes the sensor. The sensor includes a body portion, an electrode portion formed in a front of the body portion on one side of the front and adjacent to the particulate matter, a heating portion in a rear of the body portion on one side of the rear corresponding to the electrode portion, a power input portion in the rear of the body portion on the other side of the rear and to supply a power to the heating portion, and connection lines to connect the power input portion to the heating portion, which use the supplied power to generate heat for burning and removing the particulate matter.

Disclosed are a substrate level bonding method and a substrate level package formed thereby. The substrate level package includes a plurality of unit substrate sections, a base substrate, and a plurality of substrate adhesion sections. The unit substrate sections are separated from each other by holes. The base substrate is disposed to face the unit substrate sections. The substrate adhesion sections are interposed between the unit substrate sections and the base substrate to bond the unit substrate sections to the base substrate and which are formed of DFR material, whose at least one portion is uncured.

Substrate level bonding method and substrate level package

Growing community of inventors

Seoul, South Korea

Kuk-jin Chun