Samsung Electronics Co., Ltd.

Kug Sang Lee

Khee Park

Seung Jin Seo

A memory module includes a plurality of memory devices, each memory device including a plurality of memory cell arrays, a plurality of data input/output lines, and a memory cell array select input line. The plurality of memory cell arrays are arranged as a plurality of blocks such that data transfer is enabled between a memory cell array in each block of the plurality of blocks and a respective data input/output line of the plurality of data input/output lines when a predetermined voltage is applied to the memory cell array select input line. The module includes a circuit substrate on which the plurality of memory devices is mounted, the circuit substrate including first and second voltage busses. Means are provided for selectively connecting the memory cell array select input lines of the plurality of memory devices to the first and second voltage busses such that a predetermined voltage is applied to the memory cell array select input lines of the plurality of devices and data transfer is enabled between a selected memory cell array in each block of each memory device and a respective data input/output line of the memory device. Preferably, the selected memory cell arrays are free of defective memory cells, and memory devices of the plurality of memory devices have defective cells in memory cell arrays other than the selected memory cell arrays.

Memory modules, circuit substrates and methods of fabrication therefor

A method and apparatus for vertically mounting a semiconductor package is disclosed. The mounting apparatus has an extended (e.g. rectangular) shape, and is provided with a plurality of spaces adapted to receive and hold vertically semiconductor packages. To mount a semiconductor package in such a manner, the package is first inserted into a space in the apparatus provided therefor and fixedly held there. Next, a plurality of such semiconductor packages which are so held by the mounting apparatus are positioned on a printed circuit board, and their leads are soldered thereto to complete the mounting process. This facilitates both surface mounting and multi-layer wiring and decreases the potential for poor quality soldering. In addition, the mounting apparatus according to the present invention is beneficially heat dissipative, which helps to increase the life of a semiconductor package by heat which can cause deleterious thermal stresses.

Growing community of inventors

Suwon, South Korea

Kug Sang Lee