Chang Chun Plastics Co., Ltd.

Kuen Yuan Hwang

An Pang Tu

Sheng Yen Wu

Hong-Hsing Chen

Jen Fu Wang

Ching-Jui Huang

Gai-Chi Chen

Huan-Chang Chao

Jia Sheng Liau

Chie-Yih Ju

Hong Hsing Chen

Chih Fu Chen

An Bang Duh

Ching Jui Huang

Yu Lin Huang

Gai Chi Chen

Chun Hsiung Kao

Fang Shian Su

The present invention relates to a novel water soluble polyimide resin, which contains a hydrophilic functional group such as &#x2014;OH, &#x2014;COOH to increase the solubility of the polyimide resin in alkali aqueous solution, and is suitable for using as an insulation film in electronic and photoelectric products. The present invention also relates to preparation and use of the above polyimide.

Water soluble polyimide resin, its preparation and use

The present invention relates to a water soluble photosensitive polyimide polymer, preparation thereof and a photoresist composition containing the same. The water soluble photosensitive polyimide polymer is characterized by having repeat units represented by the following formula (I): the other symbols are defined in the specification].

Water soluble photosensitive polymide polymer, its preparation and photoresist containing the same

The present invention provides a phosphorus-containing compound of formula (I): wherein R, R, Rand Rare the same or different; and R, R, Rand Rare independently selected from the group consisting of hydrogen, halogen, Calkyl, haloalkyl, and alkoxy. The phosphorus-containing compound is prepared by bonding a bisphenol group to a phosphorus atom to prevent the phosphorus-containing heterocyclic molecule from exhibiting steric hindrance on hydroxyl functional groups, thereby increasing reactivity in the subsequent reactions.

Phosphorus-containing compound and method for preparing the same

A polyimide resin composition modified with bismaleimide and cyanate, which comprises (a) polyimide resin, (b) cyanate, (c) bismalemide, and (d) nanometer filler. By using the present polyimide resin composition modified with bismalemide and cyanate, heat expansion coefficient of polyimide can be reduced. Also, heat resistance and dimension stability of the polyimide resin can be improved, and thus it is suitable for cladding with copper foil to produce printed circuit board.

Polymide resin composition modified with bismaleimide and cyanate

The present invention relates to all-aromatic polyesters, a method for preparing the same, and a polyester composition containing the same. The present method is carried out in two stages of first carrying out a prepolymerization to obtain a prepolymer having a specific particle size distribution, then carrying out a solid polymerization. The present method can control the quality of polyester effectively and produce all-aromatic polyester exhibiting excellent flowability, high heat resistance, and high solder heat resistance.

All-aromatic polyester compound, its preparation, and composition containing the same

A phenolic resin having not more thanwt% of free bisphenol and a molecular weight distribution Mw/Mn of not more thanis prepared by reacting a bisphenol and aldehyde in the presence of an alkaline catalyst at a temperature of from&#xb0; C. to&#xb0; C., neutralizing with an acid, adding an acid to adjust the pH to fromto, heating to a temperature of from&#xb0; C. to&#xb0; C, and vacuuming to recover the phenolic resin.

Phenolic resin with low level of free bisphenol

The present invention relates to a flame-retarding epoxy resin composition containing no halogen, which comprises an epoxy resin containing no halogen, a toughening agent, and a flame retarding agent. The present flame-retarding epoxy resin composition exhibits a high heat-resistance and excellent adhesion and is useful as adhesive agent in flexible printed circuit board.

Flame retarding epoxy resin composition containing no halogen

The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises:

Flame retardant resin and flame retardant composition containing the same

Phosphorus and nitrogen containing resin hardener and a flame retarding resin composition containing said hardener

This invention relates to a process for preparing a high purity epoxy resin comprising reacting an aromatic compound containing hyroxyl or amino group with an excess amount of an epihalohydrin in the presence of hydroxides of alkali metal or alkali earth metal in one or more low-boiling aprotic cosolvents under normal or reduced pressure with dewatering to obtain a high purity epoxy resin with low level of hydrolyzable halides.

Growing community of inventors

Hsinchu, Taiwan

Kuen Yuan Hwang