Keysight Technologies, Inc.

Kuen Yew Lam

Jared Richard

Chris R Jacobsen

Thiam Ping Oon

James Benson

A peripheral component interconnect express (PCIe) eXtensions for instrumentation (PXIe) chassis includes a backplane, multiple peripheral slots, a mezzanine card and an integrated accelerator module. The peripheral slots are located on the backplane and configured to receive insertable PXIe peripheral modules, respectively. The mezzanine card is on the backplane and configured to accommodate at least one of connectors, integrated circuits (ICs) and signal lines incorporated in the PXIe chassis. The integrated accelerator module is on the mezzanine card within the PXIe chassis and configured to accelerate processing of signals received from the PXIe peripheral modules.

Instrumentation chassis including integrated accelerator module

An apparatus comprises a printed circuit board (PCB) having a first surface and a second surface, a plurality of blind press-fit vias penetrating the first surface and extending partially through the PCB toward the second surface, the blind press-fit vias configured to receive press-fit connectors of at least one component to be connected to the PCB, and a plurality of electrical connectors disposed in a region of the second surface opposite the blind press-fit vias and configured to interface with one or more signal processing components disposed on the second surface.

Printed circuit board comprising blind press-fit vias

The modular electronic instrumentation platform chassis is for use with a plurality of instrumentation modules and includes a frame defining a module area and a non-module area. The module area includes a plurality of slots open to a front of the frame and configured to receive instrumentation modules therein. A front panel may be carried by the front of the frame adjacent the plurality of slots. A chassis power unit is configured to provide power to the plurality of instrumentation modules received in the slots. A reference clock unit carried by the frame in the non-module area and is configured to provide a low phase-noise reference clock for the plurality of instrumentation modules received in the slots. The reference clock unit includes vibration dampening mounts that mount the reference clock unit to the frame, power supply circuitry, reference clock circuitry, a shield to isolate the power supply circuitry from the reference clock circuitry, and a plurality of reference clock outputs mounted in the front panel and coupled to the reference clock circuitry.

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Selangor, Malaysia

Kuen Yew Lam