Quanta Computer Incorporated

Kuen-Hsien Wu

Chao-Jung Chen

Yu-Nien Huang

Kuo-Wei Lee

Hou-Hsien Chang

Shih-I Liang

A heat sink having a flexible heat sink base is disclosed in order to flex the heat sink into contact with concave heat sources. Flexibility is achieved by providing a series of concentric grooves on the heat sink base on a surface opposite the surface contacting the heat source. A central cylinder is provided at the center of the concentric grooves. A biasing device, such as a spring, exerts a force on the central cylinder to flex the heat sink base.

Flexible base design for chipset heat sink

A coolant gas, multi-filter filtering unit, for use with servers and other electrical equipment that can be utilized as a retrofit device for existing servers or provided as OEM equipment with the server is described. A series of static centrifugal force filtering units are position upstream of a replaceable surface filter. The surface filter can be a HEPA filter, or alternatively include an absorbent layer or separate third filter of charcoal to remove VOCs.

Server dust collector

A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.

Transceiver hot swap contact structure

A heat dissipating apparatus for cooling a transceiver is provided. The apparatus includes a cooling jacket configured to receive the transceiver. The transceiver is secured within the cooling jacket via a connecting structure. The apparatus also includes cooling devices secured to an exterior surface of the cooling jacket, the plurality of cooling devices comprising a highly thermal conductivity material. The apparatus also includes a heat dissipation device connected to a distal end of each of the plurality of cooling devices.

Thermal solution for transceiver module

A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material.

Growing community of inventors

Taoyuan, Taiwan

Kuen-Hsien Wu