Chroma Ate Inc.

Kuei-Wen Lien

Hsiu-Wei Kuo

Chih-Hsien Wang

Xin-Yi Wu

Mao-Sheng Liu

Ben-Mou Yu

Chung-Lin Liu

Ming-Chang Wu

Sheng-Chin Chuang

Ming-Ju Chuang

Ming-Hui Wang

A support apparatus is configured to support electronic components. The support apparatus includes a tray and a plurality of recessed structures. The tray has a cavity therein and at least one intake hole communicated with the cavity. The recessed structures are disposed on the tray and recessed toward the cavity. Each of the recessed structures is configured to accommodate at least a part of a corresponding one of the electronic components and includes a support surface and a plurality of first spacers. The support surface has an exhaust hole communicated with the cavity. The first spacers are disposed on the support surface of a corresponding one of the recessed structures. When a corresponding one of the electronic components is supported on the first spacers, any adjacent two of the first spacers and the corresponding electronic component form a first flow channel.

Support apparatus

The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.

Heating furnace

Growing community of inventors

Tao-Yuan, Taiwan

Kuei-Wen Lien