Chang Chun Petrochemical Co., Ltd.

Kuei-Sen Cheng

Jui-Chang Chou

Yao-Sheng Lai

Huei-Fang Huang

Hsi-Hsing Lo

Yueh-Min Liu

Tsang-Jin Juo

Chen-Ping Tsai

Chyen-Fu Lin

Jian-Ming Huang

Chien-Ming Lai

Ting-Chun Lai

Shih-Cheng Tseng

Chih-Sheng Lu

Electrodeposited copper foils having adequate puncture strength to withstand both pressure application during consolidation with negative electrode active materials during manufacture, as well as expansion/contraction during repeated charge/discharging cycles when used in a rechargeable secondary battery are described. These copper foils find specific utility as current collectors in rechargeable secondary batteries, particularly in lithium secondary battery with high capacity. Methods of making the copper foils, methods of producing negative electrode for use in lithium secondary battery and lithium secondary battery of high capacity are also described.

Copper foil for current collector of lithium secondary battery

Provided are an electrolytic copper foil, an electrode comprising the same, and a lithium ion battery comprising the same. The electrolytic copper foil has a drum side and a deposited side opposing to the drum side, wherein a nanoindentation hardness of the drum side is equal to or larger than 0.5 GPa and equal to or smaller than 3.5 GPa; and a lightness of the drum side is equal to or larger than 25 and equal to or smaller than 75.

Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same

Provided are an electrodeposited copper foil, a current collector, an electrode, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a deposited side and a drum side opposite the deposited side. In a first aspect, &#x394;RS between the deposited side and the drum side is at most about 95 MPa, and the deposited side exhibits a Vv in a range from about 0.15 &#x3bc;m/&#x3bc;mto about 1.35 &#x3bc;m/&#x3bc;m. In a second aspect, the deposited side has a Sku of about 1.5 to about 6.5 and the deposited side exhibits a Vv in a range from about 0.15 &#x3bc;m/&#x3bc;mto about 1.35 &#x3bc;m/&#x3bc;m. The characteristics are beneficial to improve the quality of the electrodeposited copper foil, thereby extending the charge-discharge cycle life of a lithium-ion secondary battery comprising the same.

Electrodeposited copper foil, current collector, electrode, and lithium ion secondary battery comprising the same

Surface-treated copper foils including a copper foil having a first side and an opposite-facing second side and two treatment layers disposed on the first side and the second side respectively are described. Each treatment layer provides a treated surface which exhibit a ten-point average roughness Rz in a range of 1.2 &#x3bc;m to 4.6 &#x3bc;m and a peak density (Spd) in a range of 490,000 to 1,080,000 mm. Additionally, the Cr content in each of the treatment layers is a range of 25 to 70 &#x3bc;g/dm. The surface-treated copper foils have excellent electrode active material coating properties, such as good adhesion and uniformity.

Surface-treated copper foil for lithium-ion secondary batteries

Electrodeposited copper foils possessing properties for manufacturing lithium ion rechargeable secondary batteries are described, including methods of making the electrodeposited copper foils, methods for making the battery, and the resultant battery. The electrodeposited copper foils have a specific burst strength in the range of 1.5 to 4.3 kPa*m/g and a tensile strength in the range of 30 to 40 kgf/mm. The deposited side of the electrodeposited copper foil has a surface hardness in the range of 0.2 to about 2.0 Gpa by nano indentation analysis to resist wrinkling during pressing of the active materials on the electrodeposited copper foil. The foil exhibits reduced copper burr formation and burr size after clipping.

Electrodeposited copper foil with anti-burr property

The present disclosure relates to an improved, surface-treated copper foil that is resistant to rusting and discoloration. More specifically, the surface-treated copper foil is chromium-free and includes: (a) a copper foil; optionally, (b) a barrier layer on one or both sides of the copper foil, the barrier layer comprising Ni, Zn, Co, Mn, Sn or a mixture thereof; and (c) an organic layer coupled to the one or both sides of the copper foil or one or both barrier layer(s), wherein the sum total of the N, S, and Si elements of the organic layer is more than 5 normalized atomic %.

Surface-treated copper foil

The present disclosure provides an electrodeposited copper foil having a puncture strength value and a tear strength value. A ratio of the puncture strength value to the tear strength value is from 14 to 64. The present disclosure also provides a lithium-ion secondary battery. The lithium-ion secondary battery is manufactured by using the electrodeposited copper foil and has excellent charge-discharge cycle life.

Copper foil for current collector of lithium secondary battery and negative electrode including the same

Electrodeposited copper foils having properties suitable for use as negative electrode current collectors in lithium-ion secondary batteries are disclosed. The copper foil has a yield strength in the range of 11 to 45 kg/mm, and a difference in residual stress between the drum side and the deposited side of at most 95 MPa. Negative electrode current collectors for lithium-ion secondary battery, a lithium-ion secondary battery incorporating the negative electrode, and batteries containing the negative electrode current collector are also disclosed.

Copper foil for negative electrode current collector of lithium ion secondary battery

An electrodeposited copper foil of high toughness having a lightness L* value of the deposit side in the range of 36 to 74, the copper foil having a tensile strength in the range of 40 to 70 kg/mm, and a weight deviation of less than 3%. The electrodeposited copper foils are particularly useful as current collectors for anode components of rechargeable secondary batteries and tend not to form wrinkles during charge-discharge cycles of the battery and are resistant to fracture during pressing of the anode active materials onto the copper foil. Secondary batteries and methods of manufacture are also described.

Electrodeposited copper foil and method for producing the same, and current collector for lithium secondary battery and secondary battery comprising the electrodeposited copper foil

Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from the copper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.

Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making

A method and production of composite foils and thin copper foils peeled from said composite copper foils is disclosed for use in forming printed circuit boards (PCB). Either the composite foil or only the thin copper foil can be laminated to a polymer layer to form the printed circuit board, with the step of separating the thin copper foil from the composite copper foil is performed subsequent to said laminating step.

Composite thin copper foil and carrier

The present disclosure relates to a multilayer carrier foil, a core structure formed using the multilayer carrier foil, printed circuit boards, and electronic devices. The multilayer carrier foil comprises: (a) a copper carrier layer having a release side and a laminate side, the laminate side of carrier layer optionally having nodules; (b) a chromium release layer applied to the copper carrier layer; (c) an intermediate copper layer applied to the chromium release layer; (d) an anti-migration layer applied to the intermediate copper layer of (c); and (e) an ultra-thin copper layer applied to the anti-migration layer of (d). The disclosure further relates to methods of making the multi-layer carrier foil, the core structure, and printed circuit boards.

Multilayer carrier foil

A copper foil having a matte side with nickel plated thereon in an amount of nickel in the range of 100,000-300,000 &#x3bc;s/dm. The plated copper foils have particular utility in Positive Temperature Coefficient (PTC) devices. The plated copper foils have a surface hardness of from 50 to 200, a tensile strength greater than 45 kg/mmand a shiny side surface roughness (Rz) not exceeding 2.0 &#x3bc;m. The surface roughness of the matte side of the copper foil is in the range of 6 to 10 &#x3bc;m. Copper nodules are present on the matte side of the copper foil between the copper foil and the nickel plating. Methods of producing the copper foil and PTC devices incorporating the copper foil are described.

Copper foil and methods of use

The present disclosure relates to an improved electrodeposited copper foil having uniform thickness and methods for manufacturing the electrodeposited copper foil. The electrodeposited copper foil typically has one to four interfacial lines through the cross-sectional area of the foil and a weight deviation less than 2.0%. The disclosure also relates to a process for making the electrodeposited copper foil that includes the addition of one or more insulative masks to the surface of a dimensionally stable anode. The insulative mask is cut to correspond to areas of variation in electrodeposited copper foil, such that the mask causes interferences with the electrodeposition process to even out the variation.

Growing community of inventors

Taipei, Taiwan

Kuei-Sen Cheng