The Ohio State University

Other

Gm Global Technolgoy Operations, Inc.

Kubilay Sertel

Georgios Trichopoulos

Cosan Caglayan

John Leonidas Volakis

Gokhan Mumcu

Jonathan P Doane

Niru Nahar

Alebel H Arage

Syed An Nazmus Saqueb

Michael Dziatczak

A radar packaging component including a coating affixed on a substrate. The coating includes a binder and a plurality of acicular flake particles dispersed in the binder. The acicular flake particles exhibit a length and the length of at least 30 percent by volume of the acicular flake particles is oriented in a first axis. A vehicle includes a radar packaging component and a radar sensor positioned under the radar packaging component.

Polarization selective coating additives for sensor applications

Example systems and methods for antenna pattern characterization are described herein. The systems and methods are based on compressive sensing. An example method can include arranging a test antenna and a probe antenna in a spaced apart relationship; arranging a spatial light modulator within in a near field region of the test antenna; and projecting, using a light source, a plurality of light patterns onto the spatial light modulator. The method can also include transmitting, using the test antenna, a respective beam while each of the light patterns is projected onto the spatial light modulator; and receiving, using the probe antenna, a respective signal corresponding to each of the respective beams transmitted by the test antenna. The method can further include reconstructing the test antenna's near field using the respective signals received by the probe antenna. The test antenna's near field can be reconstructed using a compressive sensing algorithm.

Methods for antenna pattern characterization based on compressive sensing

Described herein are antenna-coupled radio frequency (RF) probes with replaceable tips. In the described embodiments, test signals are coupled onto a probe tip wafer via an on-tip antenna, thus the probe tip is decoupled from the probe body. This allows for separate fabrication of the probe body and the probe tip. As such, the probe tip can be made available as a 'commodity' and the user can simply replace a worn-out or damaged probe tip, providing significant savings in per-unit cost and operation cost of the new contact probes. The decoupling of probe tip and probe body allows for manual replacement of probe tip without the need for extremely accurate alignment which is typically required in extremely high frequency probes. Manual replacement of the tips is only possible due to the much less stringent alignment requirements afforded by the antenna coupling from the probe body to the probe tip.

Antenna-coupled radio frequency (RF) probe with a replaceable tip

Terahertz (THz) or millimeter wave (mmW) band characterization of a differential-mode device under test (DUT) is performed using a non-contact probing setup based on an integrated circuit that includes the on-chip DUT and an on-chip test fixture as follows. A differential transmission line pair is operatively coupled with the DUT. A first differential antenna pair at a first end of the transmission line pair has a first antenna connected only with the first transmission line and a second antenna connected only with the second transmission line. A second differential antenna pair is likewise connected with a second end of the differential transmission line pair. A THz or mmW transmitter radiates a probe THz or mmW beam to the first differential antenna pair, and an electronic analyzer receives a THz or mmW signal radiated by the second differential antenna pair responsive to the radiation of the probe THz or mmW beam to the first differential antenna pair, thus enabling no-contact S-parameter measurements for characterizing differential-mode, on-wafer, active or passive devices and integrated circuits.

On-chip, wideband, differentially fed antennas with integrated bias structures

A phased array antenna comprising a dielectric superstrate material, a ground plane material, a plurality of dipole structures located between the superstrate and ground plane materials, and a plurality of balun and matching networks in electrical communication with the plurality of dipole structures, wherein the phased array antenna is adapted to achieve a bandwidth of at least about 7:1.

Ultra-wideband extremely low profile wide angle scanning phased array with compact balun and feed structure

An imaging/detection device includes a hemispherical lens having a surface opposite a curvature of the hemispherical lens, where the hemispherical lens defines an optical axis. The imaging/detection device also includes a plurality of detectors arranged on a focal plane array that is positioned near the surface of the hemispherical lens. Each of the detectors respectively includes a diode and an antenna monolithically integrated with the diode. Additionally, at least one of the detectors is offset by a distance from the optical axis of the hemispherical lens and is configured such that a radiating pattern of the respective antenna is tilted by an angle and directed toward the optical axis of the hemispherical lens. A maximum direction of the radiating pattern of the respective antenna is related to the distance by which the detector is offset from the optical axis of the hemispherical lens.

Miniature phase-corrected antennas for high resolution focal plane THz imaging arrays

A test fixture for characterizing a device-under-test (DUT) includes first and second planar antennas and a planar waveguide arranged to guide terahertz (THz) and/or millimeter wave (mmW) radiation between the first and second planar antennas. The planar waveguide is further configured to couple THz and/or mmW radiation guided between the first and second planar antennas with the DUT. A beam forming apparatus is arranged to transmit a probe THz and/or mmW radiation beam to the first planar antenna of the test fixture. An electronic analyzer is configured to wirelessly receive a THz and/or mmW signal emitted by the second planar antenna responsive to transmission of the probe THz and/or mmW radiation beam to the first planar antenna. The planar antennas may be asymmetrical beam-tilted slot antennas.

Non-contact probe measurement test bed for millimeter wave and terahertz circuits, integrated devices/components, systems for spectroscopy using sub-wavelength-size-samples

In one exemplary embodiment, a transmission line geometry or structure may readily be realized as periodic printed coupled/uncoupled microstrip lines on dielectric and/or suitable biased ferromagnetic substrates. An example of a transmission line geometry or structure may be adapted to emulate extraordinary propagation modes within bulk periodic assemblies of anisotropic dielectric and magnetic materials. For instance, wave propagation in anisotropic media may be emulated by using a pair of coupled transmission lines () having a specially designed geometry, thereby enabling mold wave dispersion in a microwave or optical guided wave structure. Degenerate band edge resonances, frozen modes, other extraordinary modes, and other unique electromagnetic properties such as negative refraction index may be realized using unique geometrical arrangements that may, for example, be easily manufactured using contemporary RF or photonics/solid state technology.

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Hilliard, OH, United States of America

Kubilay Sertel