Industrial Technology Research Institute

National Central University

Cheer Shine Lighting Enterprises Ltd.

Kuang-Yu Tai

Ming-Te Lin

Ming-Yao Lin

Wen-Yung Yeh

Chia-Hsin Chao

Sheng-Chieh Tai

Chih-Hsuan Liu

Ming-Hsien Wu

Ra-Min Tain

Ming-Hung Chen

Chun-Kai Liu

Ming-Ji Dai

Hsi-Hsuan Yen

Jui-Ying Lin

Jyh-Chen Chen

Chun-Feng Lai

Po-Cheng Yang

Yu-Hung Chuang

Sheng-Liang Li

Farn-Shiun Hwu

Chia-Ling Li

Tse-Peng Chen

Shang-Pin Ying

Chung-Yen Hsu

A light emitting device array including a circuit substrate and a plurality of device layers is provided. The circuit substrate includes a plurality of bonding pads and a plurality of conductive bumps located over the bonding pads. The device layers are capable of emitting different colored lights electrically connected with the circuit substrate through the conductive bumps and the bonding pads. The device layers capable of emitting different colored lights have different thicknesses and the conductive bumps bonded with the device layers capable of emitting different colored lights have different heights such that top surfaces of the device layers capable of emitting different colored lights are located on a same level of height.

Transfer-bonding method for the light emitting device and light emitting device array

A display panel including a substrate, a meshed shielding pattern, and a plurality of light-emitting devices is provided. The meshed shielding pattern is disposed on the substrate so as to define a plurality of pixel regions on the substrate. The light-emitting devices are disposed on the substrate. At least one light-emitting device of the light-emitting devices is disposed in each pixel region of the pixel regions, wherein an area of the pixel region is A1, an area of the light-emitting device is A2, and a ratio of A2 to A1 is below 50%.

Display panel with high transparency

A light source device having a good heat dissipation capability is disclosed, in which heat generated by a light emitting device is conducted to a base fabricated by a porous material through a heat conducting mask or a heat conducting pipe. Due to a large area contact between the heat conducting mask or the heat conducting pipe and the base, the heat can be evenly conducted to the base, so that the base can absorb the heat and dissipate the heat to external, so as to improve a heat dissipation efficiency. Moreover, in the light source device of the disclosure, heat exchange of the light emitting device can be directly carried on through air convection, so that the heat generated by the light emitting device can be taken away from the light source device through heat exchange of cool air.

Light source device

A projection apparatus is provided. The projection apparatus includes a light-emitting unit array, an optical sensor, and a control unit. The light-emitting unit array is for emitting an image beam. The optical sensor is for detecting electromagnetic waves so as to generate a signal. The control unit is electrically coupled to the light-emitting unit array and the optical sensor for controlling emission of the light-emitting unit array according to the signal from the optical sensor.

Imaging apparatus having an optical sensor

A light emitting diode (LED) package comprising a carrier, an LED chip, a lens, and a phosphor layer is provided. The LED chip disposed on the carrier. The lens encapsulating the LED chip has a plurality of fins surrounding the LED chip and a conical indentation. The fins extending backward the LED chip radially. Each of the fins has at least one light-emitting surface and at least one reflection surface adjoining the light-emitting surface. A bottom surface of the conical indentation is served as an total reflection surface. The phosphor layer is disposed on the light-emitting surfaces of the lens. An LED package and an LED module are also provided.

Light emitting diode package and light emitting diode module

An LED package is provided. The LED package includes a carrier, an LED chip, a conductive structure, a first encapsulant, a lens and a heat sink. The carrier is cup shaped and comprises a bottom portion and a lateral wall. The LED chip is received in the carrier and disposed on the bottom portion. The conductive structure is electrically connected to the LED chip. The first encapsulant is received in the carrier and fixing the carrier and the conductive structure. The lens is corresponding to the LED chip. The carrier is embedded in the heat sink, and heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier.

LED package and method of assembling the same

A light emitting diode (LED) lamp including a socket, an LED module disposed on the socket, and a lamp housing assembled to the socket is provided. LED module includes a supporting member and a plurality of LED packages, wherein each LED package includes a chip carrier, a reflective member, an LED chip, a lens, and a phosphor layer. Reflective member mounted on the chip carrier has a recess for exposing parts of the chip carrier. LED chip disposed in the recess. Lens encapsulating the LED chip has a light-emitting surface, a first reflection surface bonded with the reflective member and a second reflection surface, wherein the LED chip faces the light-emitting surface of the lens.

Light emitting diode module, and light emitting diode lamp

A light emitting device includes a leadframe, a light emitting unit, a transparent encapsulant, and a fluorescent colloid layer. The light emitting unit is disposed on the leadframe. The transparent encapsulant covers the light emitting unit, wherein the transparent encapsulant has a concave on which at least one reflective surface is disposed. The fluorescent colloid layer is disposed outside the transparent encapsulant, wherein a chamber is formed between the fluorescent colloid layer and the transparent encapsulant. The light generated by the light emitting unit is reflected by the reflective surface and guided to a side wall of the fluorescent colloid layer.

Light emitting device

A multi-facet light emitting lamp including a first light source plate, a second light source plate, and a plurality of airflow channels is provided. The first light source plate has at least one first connecting terminal. The second light source plate has at least one second connecting terminal. The first connecting terminal is connected with the second connecting terminal, and an inner space is formed between the first light source plate and the second light source plate. The inner space and a space outside the multi-facet light emitting lamp are connected by the airflow channels.

Multi-facet light emitting lamp

The present invention provides a method for measuring the PN-junction temperature of a light-emitting diode (LED), which uses a reference voltage to establish the function of current, real power, power factor, or driving-time interval on temperature. The initial and thermal-equilibrium values of current, real power, power factor, or driving-time interval are measured, and hence the variations thereof are calculated. Referring to the pre-established function, the temperature change is given. By the temperature change and the initial temperature, the PN-junction temperature of the LED is thereby deduced.

Method for measuring PN-junction temperature of light-emitting diode (LED)

An apparatus and a method for measuring a diode chip are provided. The diode chip is placed on a thermal conductive element. The apparatus measures an instant starting current and a first temperature, which is associated with the instant starting current, of the thermal conductive element. After the diode chip operates, the apparatus adjusts the temperature of the thermal conductive element to a second temperature, such that the current of the diode chip is adjusted to be equal to the instant starting current. The apparatus calculates a property of the diode chip according to a real power of the diode chip and a difference between the first temperature and the second temperature.

Apparatus and method for measuring diode chip

A light-emitting diode packaging apparatus is disclosed, which is used for a supporting member having a plurality of supporting pieces to be inserted therein for the subsequent molding and packaging operations, including a mold base for a plurality of supporting pieces of a supporting member to be inserted therein, and a controller for inserting into the mold base and positioning the supporting member. This invention features forming a positioning foot at the periphery of at least one electrode pin of each of the supporting pieces, and also forming a corresponding first positioning aperture on the mold cup of the mold base for the positioning of the supporting pieces. The present invention also provides a mold base and supporting pieces for use with the light-emitting diode packaging apparatus.

Light-emitting diode packaging apparatus, mold base and supporting member thereof

A light emitting device and the method for producing the same are disclosed. The light emitting device has at least a light emitting unit with a first electrode and a second electrode for generating a light source when powered on, a conductive element electrically coupled to the first electrode of the light emitting unit and a substrate having a carrier portion for carrying the light emitting unit and a heat dissipating portion extending from the carrier portion and electrically coupled to the second electrode of the light emitting unit, in which the conductive element is disposed on a side of a planar face of the heat dissipating portion, thereby allowing large contact area to be established between the heat dissipating portion and a sub-heat-dissipating system or air so as to achieve good heat dissipation.

Growing community of inventors

Hsinchu, Taiwan

Kuang-Yu Tai