United Microelectronics Corp.

Getac Technology Corporation

Getac Holdings Corporation

Kuang-Yeh Chang

Hong Ma

Juei-Chi Chang

Kuo-Yun Kuo

Shi-Liang Zhong

Chia-Wei Chang

Cheng-Hung Chiang

Kao-Wen Chang

Po-Yi Ou

Wen-Zhan Zhou

Yi-chia Chiu

Fang-Ping Cheng

An electronic device includes a casing, a concave portion, and an air outlet portion. The casing includes a first side surface, a second side surface, and a third side surface that are adjacent to each other, where two sides of the first side surface are respectively connected to the second side surface and the third side surface. The concave portion is recessed at a junction of the first side surface and the second side surface and includes a first concave surface and a second concave surface. The second side surface, the first concave surface, the second concave surface, and the first side surface are sequentially connected. The air outlet portion is arranged on the first concave surface. A length of the air outlet portion in one direction is greater than a half of a length between the second side surface and the third side surface in the direction.

Electronic device

An electronic device includes a casing and an electronic assembly. The casing has an opening between a first side surface and a second side surface parallel to each other, and the opening has a first side edge and a second side edge opposite to each other. The electronic assembly is assembled in the casing, and includes a body, a connecting portion, and a waterproof ring. The connecting portion is arranged on one side of the body. The waterproof ring includes an outer ring, an inner ring, and two blocking portions. The outer ring is a closed ring, and is arranged around an outer surface of the connecting portion. The inner ring is arranged on the outer surface of the connecting portion and is closer to the body than the outer ring. The two blocking portions are each connected to the outer ring and the inner ring.

Electronic device and assembly thereof

An electronic device includes: a casing, including a first side surface and a second side surface parallel to each other; a positioning column, including a first end portion and a second end portion having a first plane and a first convex portion; and an operating member, assembled on the casing and corresponding to the positioning column, and including a push portion having a second plane and a second convex portion. When the operating member is at a first position, the first convex portion correspondingly presses against the second plane, the second convex portion correspondingly presses against the first plane, and the first end portion is accommodated in the casing. When the operating member is at a second position, the first convex portion correspondingly presses against the second convex portion, and the first end portion protrudes from the first side surface of the casing.

The present invention discloses an expansion structure for an electronic card for installing the electronic card. The expansion structure includes a carrier board, a limiting member and a fixing element. The carrier board carries the electronic card. The limiting member includes a sidewall and a blocking piece extended from the sidewall, the sidewall is formed on one side of the carrier board, and the sidewall, the blocking piece and the carrier board jointly define a sliding channel for accommodating the electronic card. The fixing element fixes the electronic card at the carrier board. Thus, a small-size electronic card can be installed on an installation interface of a large-size electronic card by the expansion structure, achieving the effect of sharing the same installation interface.

Electronic device, expansion structure for electronic card and assembly method thereof

A mobile electronic device includes a main framework, a back cover, a door cover, a functional module and a stop element. The back cover covers the main framework and has an expansion window. The door cover covers the expansion window. The functional module is disposed on an inner side of the door cover and electrically connected to a motherboard in the main framework. An operation interface corresponding in position to an outer side of the door cover is disposed on one side of the functional module. One side and the other side of the functional module oppose each other. The stop element is disposed on the inner side of the door cover, abuts against the other side of the functional module, and thus prevents the functional module from retracting under an external force. Therefore, the mobile electronic device is insusceptible to a collision and a fall.

Mobile electronic device

A mobile electronic device includes a main framework having a motherboard, a back cover covering the main framework and having an expansion window, and an expansion unit is disclosed. The expansion unit includes a door cover covering the expansion window. The door cover includes a back plate and a lateral plate, the lateral plate having an opening. A functional module is disposed on an inner side of the door cover, electrically connected to the motherboard, and has a first side on which an operation interface is disposed. The operation interface faces the opening in the lateral plate.

Mobile electronic device and expansion unit

An electronic device includes a frame, a covering structure and a functional module. The frame has an opening and a fixing portion corresponding to the opening. The covering structure and the functional module constitutes a function expansion assembly. The covering structure is used to be detachably fixed at the electronic device and to cover the opening. The functional module includes an expansion circuit board and an operation interface. The expansion circuit board is used to be detachably fixed at the fixing portion, and the operation interface is located corresponding in position to the opening. When the covering structure is detached from the electronic device, the operation interface is accessible through the opening.

Function expansion assembly and electronic device having the function expansion assembly

An electronic device having a function expansion assembly includes a host, and a function expansion assembly for function expansion of the host. The host includes an opening and a fixing portion. The function expansion assembly includes a functional module and an anti-collision module. The functional module includes an expansion circuit board and an expansion connector disposed on the expansion circuit board. The expansion circuit board is detachably fixed at the fixing portion. The anti-collision module includes a covering and a lid. The covering is detachably fixed at the host and covers the opening, and includes an insertion slot. The lid corresponds to the position of the insertion slot, and is connected in a liftable and covering manner to the covering. The lid blocks the expansion connector by covering the insertion slot.

Hand strap

Buckle

A method of fabricating a dual damascene structure is described. A dielectric layer and a metal hard mask layer are sequentially formed on a substrate having thereon a conductive layer and a liner layer. The metal hard mask layer and the dielectric layer are patterned to form a via hole exposing a portion of the liner layer. A gap-filling layer is filled in the via hole, having a height of &#xbc; to &#xbd; of the depth of the via hole. A trench is formed in the metal hard mask layer and the dielectric layer. The gap-filling layer is removed to expose the portion of the liner layer, which is then removed. A metal layer is formed filling in the via hole and the trench, and then the metal hard mask layer is removed.

Method of fabricating dual damascene structure

A via-first dual damascene process is disclosed. When forming trench lines directly above two small pitched, dense via openings having diameter that is substantially equal to the line width of the trench lines, the trench photoresist is biased on the via openings to partially mask the sidewalls of the two dense via openings. By doing this, via-to-via bridging defects can be avoided.

Method for eliminating bridging defect in via first dual damascene process

A plurality of active areas are defined on a semiconductor substrate. Then at least one gate is formed on the semiconductor substrate to cover a portion of the active area. Thereafter a plurality of source/drain are formed in the active area not covered by the gate followed by forming a first dielectric layer on the semiconductor substrate to cover the gate and the source/drain. After that, at least one pixel cap top plate is formed atop the first dielectric layer and a capacitor dielectric layer is formed atop the surface of the top plate. Finally, at least one pixel cap bottom plate is formed atop the first dielectric layer to cover the top plate.

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Taipei, Taiwan

Kuang-Yeh Chang