Advanced Semiconductor Engineering, Inc.

Kuang-Ting Chi

Chung-Hsin Chiang

Ming-Hsiang Cheng

The present disclosure provides a semiconductor package device comprising: (1) a substrate comprising a first area and a second area; (2) a semiconductor device on the first area of the substrate; (3) an antenna pattern on the second area of the substrate; (4) a first electronic component on the antenna pattern; and (5) a first package body encapsulating the first area of the substrate and the semiconductor device and exposing the antenna pattern, the first electronic component and the second area of the substrate. An upper surface of the first package body is non-coplanar with the antenna pattern on the second area of the substrate.

Semiconductor package device and method of manufacturing the same

The present disclosure provides for a semiconductor package device. The semiconductor package device includes a substrate, a first antenna, an electronic component, a package body and a second antenna. The substrate includes a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The first antenna is disposed on the first surface of the substrate. The electronic component is disposed on the second surface of the substrate. The package body is disposed on the second surface of the substrate and encapsulates the electronic component. The package body has a first lateral surface substantially coplanar with the first lateral surface of the substrate. The second antenna is disposed on the first lateral surface of the substrate and on the first lateral surface of the package body.

Semiconductor package device with antenna array

The present disclosure provides a semiconductor package device comprising a substrate, a semiconductor device, a first electronic component, an antenna pattern and a first package body. The substrate has a first area and a second area. The semiconductor device is disposed on the first area of the substrate. The first electronic component is disposed on the second area of the substrate. The antenna pattern is disposed on the second area of the substrate and electrically connected to the first electronic component. The first package body encapsulates the first area of the substrate and the semiconductor device and exposes the antenna pattern, the first electronic component and the second area of the substrate.

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Kaohsiung, Taiwan

Kuang-Ting Chi