Siliconware Precision Industries Co., Ltd.

Kuang-Neng Chung

Hsin-Lung Chung

Chi-Liang Shih

Hao-Ju Fang

Te-Fang Chu

Tsung-Hsien Hsu

Tien-Chung Huang

A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant.

Package structure and fabrication method thereof

A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a substrate having at least a carrying region and a cutting region defined on a surface thereof, wherein the cutting region surrounds the carrying region; disposing at least an electronic element on the carrying region of the substrate; disposing a shield having a recess portion and at least a positioning member extending outwards, on the carrying region of the substrate with the electronic element received in the recess portion and the positioning member extending outwards to the cutting region; and performing a cutting process along the cutting region to remove portions of the positioning member and the substrate. Therefore, the shield is precisely positioned on the substrate.

Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package

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Taichung, Taiwan

Kuang-Neng Chung