Everlight Electronics Co., Ltd.

Kuang-Mao Lu

Chieh-Yu Kang

Ru-Shi Liu

Chih-Min Lin

Yi-Ting Huang

Chun-Chih Liang

Shu-Fen Hu

Chih-Hao Hsu

Mu-Huai Fang

Hao-Yu Yang

Ho Chang

Chih-Ming Ho

Gabriel Nicolo A De Guzman

Jian-Hong Fan

Jing-Hong Lai

Ding-Hwa Cherng

Wen-Chueh Lo

Shih-Wen Lai

Chia-Wei Yang

Han-Chang Pan

Veeramani Rajendran

Yan-Shen Lin

A proximity sensing device which is disposed under the OLED panel and has an emitting module and a receiving module, is provided. The emitting module can emit an invisible light which has a peak wavelength not less than 1000 nm. The receiving module is disposed adjacent to the emitting module and can receive a reflecting light from the reflected invisible light. Therefore, the invisible light passing through the OLED panel will not cause a bright spot on the panel.

Proximity sensing device

The present invention relates to a phosphor, a method for preparing the phosphor, an optoelectronic component, and a method for producing the optoelectronic component. The phosphor has the following general formula: LaGaGeO: 3xA, yCr, 5zB, where x, y, and z do not equal to 0 simultaneously; A represents at least one of Gd and Yb; B represents at least one of Sn, Nb, and Ta. For the phosphor, its emission spectrum is within a red visible light region and a near-infrared region when excited by blue visible light, purple visible light or ultraviolet light; and it has a wide reflection spectrum and a high radiant flux. Therefore, it can be used in optoelectronic components such as LEDs to meet requirements of current medical testing, food composition analysis, security cameras, iris/facial recognition, virtual reality, gaming notebook and light detection and ranging applications.

Phosphor, method for preparing phosphor, optoelectronic component, and method for producing optoelectronic component

A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.

Semiconductor package structure

Growing community of inventors

Taipei, Taiwan

Kuang-Mao Lu