Analog Devices,inc.

Invensense, Inc.

Kuang L Yang

Baoxing Chen

Li Chen

Yingqi Jiang

Milind S Bhagavat

Xin Zhang

Fang Liu

Thomas Kieran Nunan

Firas Sammoura

Thomas Chen

Qian Zhang

Christine H Tsau

Andrew William Sparks

William David Sawyer

Jeffrey A Gregory

Jianglong Zhang

Lei Gu

Erik Tarvin

Paul Vincent Errico

Yangqi Jiang

Chen Yang

Yumeng Liu

Firas N Sammoura

Thomas D Chen

Christopher Hyde

Paul Errico

William D Sawyer

Microelectromechanical systems (MEMS) devices are described that include a proof mass movably connected to a substrate by accordion springs disposed on opposite sides of the proof mass, with a coupler coupling two of the accordion springs together. The coupler is a bar in some implementations, and may be rigid. The coupler therefore restricts the motion of the accordion springs relative to each other. In this manner, the motion of the proof mass may be restricted to preferred types and frequencies.

Coupled accordion springs in microelectromechanical systems (MEMS) devices

A microfluidic ion detector for detecting heavy metal ions in liquid and particulate matter from gas samples is described. The microfluidic ion detector includes a sample extraction structure for extracting sample ions from a sample liquid or extracting sample ions from the particulate matter of a gas sample, a separation structure for separating sample ions of different types once extracted, and a detection structure for detecting the sample ions. The microfluidic ion detector also includes a reference reservoir providing a reference ion against which the sample may be calibrated based on the operation of the separation structure. A portable, self-calibrating ion detector may be realized by including the described components on a single substrate.

Self-calibrated heavy metal detector

An exemplary energy harvester includes a piezoelectric diaphragm, an eccentric mass that rotates in response to external motion, and a piezoelectric stress inducer coupled with the eccentric mass and the piezoelectric diaphragm. The piezoelectric stress inducer deforms the piezoelectric diaphragm in response to rotational motion of the eccentric mass, causing the piezoelectric diaphragm to generate electrical energy.

Piezoelectric energy harvester for human motion

A battery housing can include a first chamber configured to receive a first electrode material, the first chamber bounded at least in part by a first inflatable casing. The battery housing can include a second chamber configured to receive a second electrode material, the second chamber bounded at least in part by a second inflatable casing. An ionically conductive partition can be disposed between the first and second chambers. A first electrical contact can be coupled to or formed with the first inflatable casing. A second electrical contact can be coupled to or formed with the second inflatable casing. The first inflatable casing can be configured to inflate in response to an injection of the first electrode material into the first chamber. The second inflatable casing can be configured to inflate in response to an injection of the second electrode material into the second chamber.

Battery housing

A super-capacitor has a substrate, at least two porous electrodes integrated within the substrate, and an electrolyte extending between the at least two porous electrodes. The electrolyte is integrated with the substrate, and is positioned within the substrate. The at least two porous electrodes and electrolyte are configured to store charge as a super-capacitor.

Integrated super-capacitor

A method of fabricating a super-capacitor provides a substrate, and then adds an electrode and electrolyte template film, having a well for receiving the electrode, to the substrate. The method also adds a second electrolyte to the electrode and electrolyte template.

Method of producing a super-capacitor

One or more conductive shielding plates are formed in a standard ASIC wafer top metal layer, e.g., for blocking cross-talk from MEMS device structure(s) on the MEMS wafer to circuitry on the ASIC wafer when the MEMS device is capped directly by the ASIC wafer in a wafer-level chip scale package. Generally speaking, a shielding plate should be at least slightly larger than the MEMS device structure it is shielding (e.g., a movable MEMS structure such as an accelerometer proof mass or a gyroscope resonator), and the shielding plate cannot be in contact with the MEMS device structure during or after wafer bonding. Thus, a recess is formed to ensure that there is sufficient cavity space away from the top surface of the MEMS device structure. The shielding plate is electrically conductive and can be biased, e.g., to the same voltage as the opposing MEMS device structure in order to maintain zero electrostatic attraction force between the MEMS device structure and the shielding plate.

Apparatus and method for shielding and biasing in MEMS devices encapsulated by active circuitry

An electric energy scavenger device has a housing forming an internal chamber with an internal wall, and a movable element contained within the internal chamber. The movable element is freely movable and unconnected to any other movable element within the internal chamber. Within the internal chamber, the device also has a plurality of piezoelectric charge conversion elements positioned along the internal wall. The plurality of piezoelectric charge conversion elements are positioned side-by-side to contact the movable element when the movable element moves within the internal chamber. In addition, the movable element is configured to simultaneously contact at least two of the plurality of side-by-side piezoelectric charge conversion elements. During use, the movable element is freely movable within the internal chamber in response to movement of the entire housing.

Electric energy scavenger device

An integrated circuit has a substrate, a super-capacitor supported by the substrate, and a battery supported by the substrate. The super-capacitor includes a super-capacitor electrode and a shared electrode, and the battery has a battery electrode and the prior noted shared electrode. The super-capacitor and battery form at least a part of a monolithic integrated circuit.

Integrated circuit with shared electrode energy storage devices

A capped micromachined device has a movable micromachined structure in a first hermetic chamber and one or more interconnections in a second hermetic chamber that is hermetically isolated from the first hermetic chamber, and a barrier layer on its cap where the cap faces the first hermetic chamber, such that the first hermetic chamber is isolated from outgassing from the cap.

MEMs device with outgassing shield

A method of producing a super-capacitor provides a first substrate having a first base, forms a first electrode on the first substrate, and forms a separator so that the electrode is between the first base and the first separator. The method also micromachines holes through the separator, forms a chamber, and adds electrolyte, having ions, to the chamber. The electrolyte is in contact with the first electrode within the chamber. In addition, the holes are sized to permit transmission of the ions of the electrolyte through the holes.

Super-capacitor with separator and method of producing the same

One or more stopper features (e.g., bump structures) are formed in a standard ASIC wafer top passivation layer for preventing MEMS device stiction vertically in integrated devices having a MEMS device capped directly by an ASIC wafer. A TiN coating may be used on the stopper feature(s) for anti-stiction. An electrical potential may be applied to the TiN anti-stiction coating of one or more stopper features.

Apparatus and method for preventing stiction of MEMS devices encapsulated by active circuitry

A microphone system includes a diaphragm suspended by springs and including a sealing layer that seals passageways which, if left open, would degrade the microphone's frequency response by allowing air to pass from one side of the diaphragm to the other when the diaphragm is responding to an incident acoustic signal. In some embodiments, the sealing layer may include an equalization aperture to allow pressure to equalize on both sides of the diaphragm.

Low frequency response microphone diaphragm structures and methods for producing the same

A microchip has a base die with a conductive interconnect and an isolation trench around at least a portion of the conductive interconnect, and a cap die secured to the base die. A seal, formed from a metal material, is positioned between the base die and the cap die to secure them together. The microchip also has a blocking apparatus, between the isolation trench and the metal seal, that at least in part prevents the metal material from contacting the interconnect.

Growing community of inventors

Newton, MA, United States of America

Kuang L Yang