Industrial Technology Research Institute

Intellectual Property Innovation Corporation

Kuang-Jung Chen

Shu-Tang Yeh

Cheng-Chung Lee

Chih-Chia Chang

Jia-Chong Ho

Jing-Yi Yan

Heng-Yin Chen

Kai-Ming Chang

Sheng-Po Wang

Jian-Lin Wu

Yu-Hsiang Tsai

Kuan-Ting Chen

Yi-Shou Tsai

Wei-Yi Lin

Yi-Chuan Lu

Chen-Wei Lin

Chih-Chieh Hsu

Jui-Chang Chuang

Yu-Tang Tsai

Tzu-Yi Yu

Sheng-Wei Chen

Isaac Wing-Tak Chan

Ping-I Shih

Kung-Yu Cheng

Yi-Hao Peng

Hsin-Yuan Su

Yung-Sheng Wang

A transparent display device, a control method thereof and a controller thereof are provided. The transparent display device includes a transparent display, a first sensor set, a second sensor set and a controller. The first sensor set senses user information in a first side. The second sensor set senses scene information in a second side. The controller analyzes and determines a location and a gaze direction of a user according to the user information, calculates a first fixation point in the scene information and a second fixation point on the transparent display according to the location and the gaze direction of the user, determines a target object corresponding to the first fixation point according to the scene information, inquires target object information corresponding to the target object, and presents the target object information according to the second fixation point by the transparent display.

Transparent display device, control method thereof and controller thereof

A transparent display device including a substrate having a light emitting region and a light transmitting region, a light emitting element located in the light emitting region, a first wall structure having an undercut sidewall, a first top conductive pattern and a barrier multi-layer structure is provided. The first wall structure forms the boundary between the light emitting region and the light transmitting region and the light emitting element is located in the light emitting region surrounded by the first wall structure. The first top conductive pattern is disposed on the top surface of the first wall structure. The barrier multi-layer structure is disposed on the light emitting element. The barrier multi-layer structure includes a first barrier layer and a second barrier layer. An overlapping portion of the first barrier layer and the second barrier is located in the light emitting region surrounded by the first wall structure.

Transparent display device with wall structure

In an embodiment of the disclosure, a touch-sensing display panel includes a substrate, connection electrodes, a touch-sensing device layer, a buffer layer, a display device, and conductive vias. The substrate has a display area and a non-display area connecting the display area. The connection electrodes are located on the non-display area of the substrate. The touch-sensing device layer is located on the substrate. The buffer layer covers the touch-sensing device layer. The display device including a first electrode layer, a second electrode layer, and a display medium layer is disposed on the buffer layer and corresponds to the display area. The first electrode layer and the second electrode layer extend from the display area to the non-display area. The conductive vias penetrate the buffer layer and correspond to the non-display area. The first electrode layer and the second electrode layer are electrically connected to the connection electrodes via the conductive vias.

Touch-sensing display panel

A method for driving a dual-media display panel includes the following. Display data is obtained. A first driving signal for driving a transparent display panel of the dual-media display panel is generated in response to the display data. A display-unit grayscale value for the display data is obtained. The display-unit grayscale value is determined whether it falls within a grayscale value interval. When the display-unit grayscale value is less than a lower limit of the grayscale value interval, a driving signal adapted to enabling the light-shielding display panel to display a black color is used as the second driving signal. When the display-unit grayscale value is greater than an upper limit of the grayscale value interval, a driving signal adapted to enabling the light-shielding display panel to display a white color is used as the second driving signal.

Method for driving dual-media display panel, and electronic device and display system using the same

A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5&#xd7;10gram/cm.

Environmental sensitive element package and encapsulation method thereof

The invention provides a flexible display and method for fabricating the same. The flexible display includes: a first flexible substrate and an oppositely disposed second flexible substrate; a TFT layer and an emitting unit, sequentially formed on the first flexible substrate; a color filter layer and an overcoat formed on the second flexible substrate; a fill formed between the first flexible substrate and the second flexible substrate; and a dam formed between the first flexible substrate and the second flexible substrate and surrounding the fill.

Flexible display and method for fabricating the same

A protective structure includes an impact resistant structure and an anti-scratch structure. The impact resistant structure includes a plurality of buffer structures and a plurality of filling structures located around the buffer structures. The anti-scratch structure is located over the impact resistant structure. The anti-scratch structure includes a hard coat layer which covers the impact resistant structure, and a surface anti-scratch layer which covers the hard coat layer.

Protective structure having anti-scratch layer

An environmentally sensitive electronic device package including a first adhesive, at least one first side wall barrier, a first substrate, and a second substrate is provided. The first adhesive has a first surface and a second surface opposite to the first surface. The first side wall barrier is distributed in the first adhesive. The first substrate is bonded with the first surface. The first substrate has an environmentally sensitive electronic device formed thereon and the environmentally sensitive electronic device is surrounded by the first side wall barrier. The second substrate is bonded with the second surface. A manufacturing method of the environmentally sensitive electronic device package is also provided.

Functional film

A package of an environmentally sensitive electronic device and a fabricating method thereof are provided, wherein the package may include a first substrate, a second substrate, the environmentally sensitive electronic device, a packaging body, and a filler. In one or more embodiments, the environmentally sensitive electronic device may be disposed on the first substrate and located between the first substrate and the second substrate. The filler is disposed between the first substrate and the second substrate and covers the environmentally sensitive electronic device. The packaging body is sandwiched between the first substrate and the second substrate and encloses the environmentally sensitive electronic device and the filler. A material for the packaging body may include a bonding of transition metal and metalloid.

Package of environmentally sensitive electronic device and fabricating method thereof

In one embodiment, a package of an environmental sensitive element including a flexible substrate, an environmental sensitive element and an encapsulation is provided. The environmental sensitive element is disposed on the flexible substrate. The encapsulation covers the environmental sensitive element, wherein the Young's mudulus of the encapsulation ranges from about 5 GPa to about 15 GPa, hardness of the encapsulation ranges from about 0.4 GPa to about 1.0 GPa, and water vapor transmittance rate (WVTR) of the encapsulation is less than 10g/cmday.

Package of environmental sensitive element

An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, at least one first side wall barrier structure, at least one thermal protrusion, and a first filler layer is provided. The second substrate is disposed above the first substrate. The environmental sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The first side wall barrier structure is disposed on the second substrate and located between the first substrate and the second substrate, wherein the first side wall barrier structure is located on at least one side of the environmental sensitive electronic device. The thermal protrusion is located on the second substrate. The first filler layer is located between the first substrate and the second substrate and covers the environmental sensitive electronic device, the first side wall barrier structure, and the thermal protrusion.

Environmental sensitive electronic device package

An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.

Environmental sensitive electronic device package and manufacturing method thereof

An environmental sensitive electronic device package having side wall barrier structure may include a first substrate, a second substrate, an environmental sensitive electronic device, a first adhesive, a third substrate, at least one first side wall barrier structure, and a second adhesive. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located between the first and second substrates and covers the environmental sensitive electronic device. The third substrate is located below the first substrate. The first substrate is located between the second and third substrates. The first side wall barrier structure is located on the third substrate and between the first and the third substrates, wherein the first side wall barrier structure is embedded in the first substrate. The second adhesive is located between the first and third substrates and covers the second first side wall barrier structure.

Environmental sensitive electronic device package having side wall barrier structure

A foldable package structure including a first substrate, a second substrate, a plurality of adhesive layers and at least one environmental-sensitive electronic component is provided. At least one of the first and second laminated substrates comprises an ultra-thin glass plate. The foldable package structure comprises a predetermined folded region and the ultra-thin glass plate is disposed at one side of the predetermined folded region and stays away from the predetermined folded region.

Foldable package structure

An environmental sensitive electronic device package includes a first substrate, a second substrate, an environmental sensitive electronic device, at least one side wall barrier structure, and a filler layer. The first substrate has at least one predetermined flexure area. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate and between the first substrate and the second substrate. The side wall barrier structure is located between the first substrate and the second substrate and surrounds the environmental sensitive electronic device. The side wall barrier structure has at least one flexure stress dispersing structure that is located in the predetermined flexure area. The filler layer is located between the first substrate and the second substrate and covers the side wall barrier structure and the environmental sensitive electronic device.

Growing community of inventors

Hsinchu County, Taiwan

Kuang-Jung Chen