Intel Corporation

Kuang-Han Chu

Nisha Ananthakrishnan

Amram Eitan

Elah Bozorg-Grayeli

Sivakumar Nagarajan

Liwei Wang

Craig Jonathan Weinman

Venmathy McMahan

Amrita Mallik

Craig J Weinman

Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.

Two material high K thermal encapsulant system

Growing community of inventors

Somerville, MA, United States of America

Kuang-Han Chu