Advanced Chip Engineering Technology, Inc.

Kuang-Chi Chao

Wen-Kun Yang

Cheng-hsien Chiu

Jui-Hsien Chang

Chihwei Lin

Chin-Chen Yang

Wen-Bin Sun

Chun-Hui Yu

His-Ying Yuan

The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A back surface of the die is directly adhered on a substrate and a first buffer layer is formed on the substrate. The substrate is configured over a second buffer layer such that the second buffer layer substantially encompasses the whole substrate to decrease damage to the substrate when the side of the substrate is collided with an external object.

Semiconductor device protective structure and method for fabricating the same

A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.

Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP

Growing community of inventors

Kaohsiung, Taiwan

Kuang-Chi Chao