Intel Corporation

Lightmatter, Inc.

Kuang C Liu

Gregorio R Murtagian

Zhichao Zhang

Steven A Klein

Feifei Cheng

Jeffory L Smalley

Srikant Nekkanty

Gaurav Chawla

Eric W Buddrius

Michael Garcia

Feroz Mohammad

Kemal Aygun

Joshua Heppner

Mark D Summers

Rajasekaran Swaminathan

Donald Tiendung Tran

Thomas A Boyd

David J Llapitan

Kelly P Lofgreen

Vijaykumar Krithivasan

Jonathan W Thibado

Kevin Ceurter

Jonathon Robert Carstens

Ravindranath Vithal Mahajan

George Vergis

Michael T Crocker

Nicholas Christopher Harris

Sanka Ganesan

Darius Bunandar

Russell S Aoki

Xiang Li

Ram S Viswanath

Je-Young Chang

James D Williams

Hong Xie

Ralph V Miele

Pramod Malatkar

Edvin Cetegen

Joe F Walczyk

Dingying David Xu

Sriram Srinivasan

Sergio Antonio Chan Arguedas

Dimitrios Ziakas

Bassam N Coury

Michael L Rutigliano

Paul J Diglio

Mohit Mamodia

Kyle Jordan Arrington

Mohanraj Prabhugoud

Kyle Yazzie

Anthony P Valpiani

Joseph B Petrini

Chong J Zhao

Todd R Coons

Mani Prakash

Raanan Sover

Anthony Kopa

John M Lynch

Christopher Wade Ackerman

Carlos Dorta-Quinones

Karumbu Meyyappan

Srinivasa R Aravamudhan

Bradley H Smith

Shelby A Ferguson

Alexey Chinkov

Thomas T Holden

Emad Al-Momani

Daniel Neumann

Alexander W Huettis

Ahmet C Durgun

Binoy Shah

Sandeep Sane

Jessie Rosenberg

Elliot Greenwald

Srinivasan Ashwyn Srinivasan

Nikhil Kumar

Steven Klinger

Meir Cohen

Jason Armstrong

Nir Peled

Luis Gil Rangel

Muffadal Mukadem

Francis Toth, Jr

Hemant Mahesh Shah

Yang Jiao

Kevin J Ceurter

Described herein are wavelength division multiplexing (WDM) transceivers configured to support fast, bidirectional communication over optical channels. An optical transceiver comprises a transmitter, a receiver, an input/output (I/O) port and an optical interleaver. The transmitter comprises a first bus waveguide and a plurality of optical modulators coupled to the first bus waveguide, each of the optical modulators being resonant at a respective wavelengths in a first wavelength set. The receiver comprises a second bus waveguide and a plurality of optical filters coupled to the second bus waveguide, each of the optical filters being resonant at a respective wavelength in a second wavelength set. The (I/O) port is coupled to an optical channel. The optical interleaver is configured to selectively couple light having wavelengths in the first wavelength set from the first waveguide bus to the I/O port, and selectively couple light having wavelengths in the second wavelength set from the I/O port to the second bus waveguide.

Spectrally interleaved optical transceivers

A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.

Immersion cooling for integrated circuit devices

Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

Compression mounted technology (CMT) socket retention mechanisms to board or interposer

Techniques and mechanisms for coupling packaged devices with a socket device. In an embodiment, the socket device comprises a socket body structure and conductors extending therethrough. A pitch of the conductors is in a range of between 0.1 millimeters (mm) and 3 mm. First and second metallization structures also extend, respectively, from opposite respective sides of the socket body structure. In the socket body structure, a conductive shield structure, electrically coupled to the first and second metallization structures, substantially extends around one of the conductors. For each of the first and second metallization structures, a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm, a portion of a side of the metallization structure forms a respective corrugation structure, and a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.

Dual-sided socket device with corrugation structures and shield structures

Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket

Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.

Pressure features to alter the shape of a socket

A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.

Conformable heat sink interface with a high thermal conductivity

Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.

Connectors for integrated circuit packages

Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.

Cable retention assemblies including torsional elements

A thermal heat for integrated circuit die processing is described that includes a thermal barrier. In one example, the thermal head has a ceramic heater configured to carry an integrated circuit die, a metal base, and a thermal barrier between the heater and the base.

Thermal head with a thermal barrier for integrated circuit die processing

An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.

Electronic device, socket, and spacer to alter socket profile

Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.

Techniques and configurations to control movement and position of surface mounted electrical devices

An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.

Universal linear edge connector

Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

CPU package substrates with removable memory mechanical interfaces

Growing community of inventors

Queen Creek, AZ, United States of America

Kuang C Liu