Industrial Technology Research Institute

Other

Kuan-Wei Chen

Chang-Ho Liou

Kuo-Hua Tseng

Ming-Daw Chen

Shyh-Shyuan Sheu

Chih-Sheng Lin

Sih-Han Li

Erh-Hao Chen

Yan-Rung Lin

Wen-Ching Ko

Pei-Jer Tzeng

Chien-Chou Chen

Che-Yuan Sun

Ya-Wen Yang

Po-Chih Chang

A readout circuit for a sensor and a readout method thereof are provided. The readout circuit includes a reference circuit, a compensated circuit, and a signal processing circuit. The reference circuit provides a direct current (DC) signal. The compensated circuit is coupled to the reference circuit. The compensated circuit obtains an analog sensing signal of the sensor, obtains the DC signal from the reference circuit, and provides a compensated signal according to the analog sensing signal and the DC signal. The signal processing circuit is coupled to the compensated circuit. The signal processing circuit processes the compensated signal to convert the compensated signal into a digital sensing signal. The compensated circuit subtracts the DC signal from the analog sensing signal to provide the compensated signal.

Readout circuit for sensor and readout method thereof

A method of manufacturing a sensor device is provided. In the method, sensing electrodes are formed on a substrate, a sensing material layer is formed on the sensing electrodes. The sensing material layer is etched to form a first nanowire sensing region, a second nanowire sensing region and a third nanowire sensing region respectively between every two sensing electrodes of the sensing electrodes. A dielectric layer is formed to cover the first nanowire sensing region, the second nanowire sensing region and the third nanowire sensing region, and the first nanowire sensing region and the third nanowire sensing region are exposed.

Method of manufacturing sensor device

A sensor device and a method of manufacturing the same are provided. The sensor device includes a substrate, a plurality of sensing electrodes, a humidity nanowire sensor, a temperature nanowire sensor, and a gas nanowire sensor. The sensing electrodes are formed on the substrate, and the humidity, the temperature and the gas nanowire sensors are also on the substrate. The humidity nanowire sensor includes an exposed first nanowire sensing region, the temperature nanowire sensor includes a second nanowire sensing region, and the gas nanowire sensor includes a third nanowire sensing region.

Sensor device and method of manufacturing the same

A bonding structure including a first substrate, a second substrate, and an adhesive layer is provided. The first substrate has a plurality of first trenches. The adhesive layer is located between the first substrate and the second substrate, and the first trenches are filled with the adhesive layer.

Wafer bonding method and device with reduced thermal expansion

A readout apparatus and a driving method for sensor are provided. The readout apparatus includes an adjustable bias unit, a sensor unit, a signal converting unit, a checking unit and a control unit. The sensor unit senses physical energy and outputs a sensing result by using a bias voltage outputted from the adjustable bias unit. The control unit controls the adjustable bias unit according to the sensing result, so as to adjust the bias voltage. Therefore, the readout apparatus can reduce continuous power loss caused by long-term detection.

Readout apparatus and driving method for sensor

A flat speaker unit is provided herein. The flat speaker unit includes a first porous electrode, a second porous electrode, and a vibrating membrane with an electret layer disposed there between. In one embodiment, a plurality of supporting members may be configured between the vibrating membrane and the first porous electrode, or between the vibrating membrane and the second porous electrode. In one embodiment, a flat speaker device is provided with at least two flat speaker unit stacked together. By electrically connecting two ends of a signal source respectively to the first and second porous electrodes, or, in another embodiment, electrically connecting one end of the signal source to both of the first and second porous electrodes and connecting another end of the signal source to the vibrating membrane, a sound with low THD is generated accordingly from the flat speaker unit.

Flat speaker unit and speaker device therewith

A speaker structure includes a membrane, an electrode which has a plurality of holes, a frame holding member and at least one set of supporting members. The frame holding member forms an exterior shape of the speaker structure and holds the membrane and the electrode at two opposite sides. Each of the set of the supporting members has a geometric structure and is placed in a space opposite to a soniferous hole region between the electrode and the membrane, so as to prevent the membrane and the electrode from contacting.

Flat speaker structure

A driving interface device adaptive to a flat speaker is introduced herein. The driving interface device is coupled with an external sound source for receiving sound signals, and boosts voltage levels of the sound signals to drive the thin flat speaker without using an external power source. In one embodiment, an impedance component is provided in the driving interface device for coupling to the external sound source, so as to drive the flat speaker.

Driving interface device adaptive to a flat speaker

A flat speaker apparatus including a driving circuit module, a flat speaker and a thermally conductive connector, and with a heat dissipating structure is introduced. The flat speaker includes a porous electrode and a vibrating film. The porous electrode causes the vibrating film to vibrate according to an audio signal output from the driving circuit module for generating sound. The thermally conductive connector connects the driving circuit module and the flat speaker to conduct heat from the driving module to the flat speaker for dissipation. A method for heat dissipation of the flat speaker is also introduced herein.

Flat speaker apparatus with heat dissipating structure and method for heat dissipation of flat speaker

A hammering tool with buffer design includes: a hammering member, a protrusion block section extending from a lower side of the hammering member, a right side of upper section of the protrusion block section being notched to form a first receiving space; a handle member having a grip section, a first plate section, a second plate section and a third plate section being disposed at an upper end of the grip section to define a receiving chamber for inserting the protrusion block section therein; a pivot member for pivotally connecting the protrusion block section of the hammering member with the handle member; and a buffer assembly including a first compression spring received in the first receiving space. A right end face of the protrusion block section of the hammering member is spaced from a left face of the first plate section by a predetermined buffering distance.

Hammering tool with buffer design

Screwdriver

Tool box

A tool box includes: a first casing having a receiving space, a first horizontal slot and a first arcuate slot being formed on an outer face of a first left board section of the first casing, a second horizontal slot and a second arcuate slot being formed on an outer face of a first right board section of the first casing; a locating seat having multiple receiving holes and pivotally disposed in the receiving space; and a second casing. A first and a second raised sections are disposed on an inner face of a second left board section of the second casing. A third and a fourth raised sections are disposed on an inner face of a second right board section of the second casing. The first and second raised sections are engaged in the first horizontal slot and the third and fourth raised sections are engaged in the second horizontal slot.

Growing community of inventors

Taichung, Taiwan

Kuan-Wei Chen