Hewlett-packard Development Company, L.p.

Other

Kuan-Ting Wu

Wei-Chung Chen

Hsing-Hung Hsieh

Chi Hao Chang

Chi-Hao Chang

Super Liao

Chung-Hua Ku

Ya-Ting Yeh

Cheng-Feng Liao

Kevin Voss

Wei Kuang Chu

Chien-Ting Lin

Cheng-Hua Yu

Wei-Kuang Chu

Xuan-Fang Shi

Kun-Hung Lin

Chung-Hung Huang

Chih-Hsiung Liao

Yu-Chuan Kang

Chienlung Yang

Chao-Wen Cheng

Hung-Ming Chen

Hui He

Shih Huang Wu

Ai-Tsung Li

Kun Chih Wang

Hendry Huang

Yu-Ling Lin

Yi-Chen Chen

Michael J Delpier

Alexander Wayne Clark

Alexander Williams

Hui Leng Lim

Ann Alejandro Villegas

David A Pipho

Chung Hua Ku

DeHuei Chen

Charlie Ku

Wen-Hua Ni

Yao-Wen Fan

Cheng-Chien Chen

Chalam Kashyap

Hsin-Chien Chu

Chih Chen Hung

Shreenath Anandakrishnan

Chien-Chih Chiu

Kun Cheng Tsai

Hsueh Chen Hung

Ying-Hung Ku

Hsin-Yi Lee

Hsiao-Jou Lin

Xuan Shi

Jamal Wakil

Wen-Hua (Jerry) Ni

Yu-Chuan (Tony) Kang

Shih-Hsun Huang

Yao-Win Fan

Chien Lung Yang

Jamil Wakil

Herein is described a substrate coated with a thermal management material for an electronic device, wherein the thermal management material comprises: a thermal conductive coat deposited on the substrate; and a heat insulation coat deposited on the thermal conductive coat, wherein the heat insulation coat comprises a plant root powder and a resin. A process for coating the substrate with a thermal management material, and an electronic device having a housing comprising a thermal management material is also described herein.

Substrate coated with a thermal management material

The present disclosure is drawn to displays for electronic devices. In one example, the display includes a light emitting layer with an organic light emitting element. A porous substrate can be attached to the light emitting layer, wherein the porous substrate is flexible and spreads heat generated by the light emitting layer. A cover layer can be attached to a surface of the porous substrate opposite the light emitting layer.

Heat spreading substrate for a display

The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include a light metal substrate including a first surface. A first micro-arc oxidation layer may be on the first surface of the light metal substrate, the first micro-arc oxidation layer can include a cationic dye bonded to the first surface via an anionic inorganic bridging compound.

Covers for electronic devices

The present disclosure is drawn to housings for electronic devices. In one example, a housing for an electronic device can include a rigid substrate having an exterior surface including a recessed region positioned at an opening extending through the rigid substrate connecting the recessed region to an interior surface of the rigid substrate. A conductive metal antenna is conformally carried by the recessed region and positioned at the opening.

Housings for electronic devices

The present disclosure describes thermal management devices. In one example, a thermal management device can include a processing unit, a thermal grease layer directly contacting the processing unit, and a heat pipe. The heat pipe can include a heat pipe interior volume having a working fluid disposed therein, a first exterior surface directly contacting the thermal grease layer, a second exterior surface opposite from the first exterior surface, and side exterior surfaces connecting the first exterior surface and the second exterior surface. The thermal management device can also include a device cover spaced from the second exterior surface of the heat pipe by a distance from greater than 1 mm to about 5 mm, and a bracket having a clamping portion that holds the heat pipe by the side exterior surfaces of the heat pipe. The clamping portion does not extend past the first exterior surface of the heat pipe.

Thermal management devices

An example dual plate Organic Light-Emitting Field-Effect Transistor (OLET) display device includes a first plate device having a first substrate; a gate layer adjacent to the first substrate; and a dielectric layer adjacent to the gate layer. A second plate device is connected to the first plate device. The second plate device includes a second substrate; a source/drain layer adjacent to the second substrate; and a stacked active organic layer adjacent to the source/drain layer. The first plate device and the second plate device are to be independently fabricated and joined together to position the stacked active organic layer adjacent to the dielectric layer.

Dual plate OLET displays

A display device includes an aperture layer, a first plurality of light sources, a second plurality of light sources, and a piezo material coupled to the first plurality of light sources and the second plurality of light sources. The aperture layer includes a first plurality of apertures and a second plurality of apertures, and the first plurality of light sources is arranged to correspond to the first plurality of apertures, and the second plurality of light sources is arranged to correspond to the second plurality of apertures. The piezo material is configured to alter a first position of the first plurality of light sources relative to the first plurality of apertures, and to alter a second position of the second plurality of light sources relative to the second plurality of apertures.

Display with piezo material changing position of light source relative aperture layer

The present subject matter relates to Nickel-free (Ni-free) sealing of anodized metal substrates. In an example mentation of the present subject matter, an anodized metal substrate is disposed with a first layer of a Ni-free sealing material over a surface of the anodized metal substrate. Further, a second layer of a second sealing material is disposed atop the first layer to sandwich the first layer of Ni-free sealing material between the surface of the anodized metal substrate and the second layer, to form a sealed metal substrate.

Nickel-free sealing of anodized metal substrates

A system that can intelligently help a user judge the resolution requirement of the image content. In an example, the display panel can show in different virtual resolutions or the system can automatically judge whether the image content requires high or low resolution using a similarity judgement. The system can then inform the display panel what virtual resolution should be shown or what the optimal resolution is using the similarity judgment and send the image content to the display panel with that resolution.

Resolution switching

In examples, an electronic device comprises a camera and a display having a transparent area aligned with the camera. The display comprises a first line corresponding to a pixel row or column of the display, the first line extending from a first end of the display to the transparent area. The display comprises a second line corresponding to the pixel row or column and extending from a second end of the display to the transparent area, the first and second lines separated by a gap. The electronic device includes a controller coupled to the display, the controller to drive the first and second lines consecutively.

Controllers to drive display lines

The present disclosure is drawn to re-workable adhesives for electronic devices. In one example, a re-workable adhesive for an electronic device can include a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive. The hot-melt adhesive can have a reduced bond strength at an elevated temperature. The re-workable adhesive can also include a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.

Re-workable adhesives for electronic devices

A coated metal alloy substrate, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises a passivation layer deposited on the metal alloy substrate, a porous conductive water borne carbon nanotube layer on the passivation layer, and an electrophoretic deposition layer deposited on the porous conductive water borne carbon nanotube layer.

Coated metal alloy substrates and process of production thereof

A coated metal alloy substrate with at least one chamfered edge, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least one chamfered edge comprises a hydrophobic anti-fingerprint layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and a water based paint layer deposited on the passivation layer.

Coated metal alloy substrate with at least one chamfered edge and process for production thereof

The application discloses examples of a device housing of an electronic device including a magnesium-alloy substrate. The device housing further including a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.

Device housing with metallic luster

In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.

Electronic device housings with patterned electrolytic plating layers

Growing community of inventors

Taipei, Taiwan

Kuan-Ting Wu