Taiwan Semiconductor Manufacturing Comp. Ltd.

TSMC Solar Ltd.

Kuan-Min Lin

Yung-Sheng Chiu

Yi-Feng Huang

Chi-Yu Chiang

Hsuan-Sheng Yang

Hao-Yu Cheng

Chen-Yun Wang

Jin-Ji Shen

An light apparatus used in forming a solar cell includes a housing separate from other processing in a deposition processing system, a transport mechanism for carrying a solar cell into the housing after deposition of a front contact layer in the deposition processing system, and one or more light source elements arranged to apply light on the solar cell after deposition of the front contact layer. A method of making a solar cell includes forming a back contact layer on a glass substrate, forming an absorber layer on the back contact layer, forming a buffer layer on the absorber layer, and forming a front contact layer above the buffer layer, the glass substrate, back contact layer, absorber layer, buffer layer, and front contact layer forming a first module. The method includes applying a light source to the first module after forming the front contact layer separate from other processing.

Apparatus and method for producing solar cells using light treatment

An alignment station for aligning probe needles on a probe card prior to testing of integrated circuits on a wafer. The alignment station includes a probe card support or chuck for receiving a probe card and mask carrier arms which support a needle alignment mask and are operable to selectively place the mask into contact with the probe needles and raise the mask out of contact with the probe needles.

Flip-over alignment station for probe needle adjustment

A new and improved bonding pad having separate areas for probe needle contact and wire bonding in semiconductor packaging technology. The bonding pad typically has a generally elongated, rectangular configuration with a wire bonding area at one end and a probe needle contact area at the other end of the pad. At least one notch mark may be provided on or adjacent to the bonding pad between the wire bonding area and the probe needle contact area for demarcating these areas during chip production.

Bonding pad with separate bonding and probing areas

Growing community of inventors

Taipei, Taiwan

Kuan-Min Lin