Acer Inc.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Starvr Corporation

Kuan-Lin Chen

Chun-Hsien Chen

Yen-Chou Chueh

Hui-Ping Sun

Wei-Chih Wang

Chi-Tai Ho

Jian-Jou Lian

Neng-Jye Yang

Yao-Wen Hsu

Chun-Hung Wen

Li-Min Chen

Kuo Bin Huang

Chia-Wei Wu

Chih-Heng Tsou

Yu-Cheng Shih

Cheng-Wen Hsieh

Yu-Ming Lin

Tsung-Ting Chen

Chun-Chieh Wang

Wen-Neng Liao

Ker-Wei Lin

Chun-Yu Chen

Chun-Ta Chen

Jau-Han Ke

Hao-Ming Chang

Wei-Der Sun

Tsung-Yi Chou

Hao-Wei Kang

Kuang-Hua Lin

Wei-Chin Chen

Jen-Chieh Shih

Mao-Neng Liao

A heat dissipation system suitable for a portable electronic device with two heat sources includes a centrifugal fan, two heat dissipation fin sets, a gate, a first heat pipe, a second heat pipe, and a control unit. The centrifugal fan has a main outlet and a sub outlet. The heat dissipation fin sets are disposed respectively at the main outlet and the sub outlet, and the gate is disposed at the sub outlet. The first heat pipe thermally contacts the heat sources and the heat dissipation fin set located at the main outlet. The second heat pipe thermally contacts one of the heat sources and the two heat dissipation fin sets. The control unit is electrically connected to the gate to drive the gate to open or close the sub outlet based on a load of the two heat sources.

Heat dissipation system

A multi-loop cycling heat dissipation module including a first tank, a first pipe, a second tank, and a second pipe is provided. The first pipe is connected to the first tank to form a first loop, a first working fluid fills the first loop to transfer heat via phase transformation, and a first high-temperature section and a first low-temperature section are formed on the first pipe. The second pipe is connected to the second tank to form a second loop, a second working fluid fills the second loop to transfer heat via phase transformation, and a second high-temperature section and a second low-temperature section are formed on the second pipe. The first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section.

Multi-loop cycling heat dissipation module

A physical vapor deposition (PVD) system includes: a pedestal configured to accommodate a semiconductor wafer; a cover plate above the pedestal configured to hold a target; and a collimator disposed above the pedestal and below the cover plate. The collimator has an upper surface and a lower surface. The lower surface is flat, and the upper surface is non-flat. A first thickness, in a vertical direction, of the collimator at a central portion is smaller than a second thickness, in the vertical direction, of the collimator at a peripheral portion.

PVD system and collimator

A centrifugal heat dissipation fan including a housing and a blade wheel disposed in the housing is provided. The housing has two inlets on a rotation axial direction of the blade wheel and at least one outlet on a rotation radial direction of the blade wheel. The blade wheel has a hub and a plurality of metal blades disposed and surrounding to the hub. Each of the metal blades has a body, an upper bending plate and a lower bending plate, wherein the upper bending plate and the lower bending plate are movable relative to the body. An including angle of the upper bending plate relative to the body, and an including angle of the lower bending plate relative to the body are changeable along with the rotating speed of the blade wheel.

Centrifugal heat dissipation fan

A semiconductor device and method of manufacture are provided. After a patterning of a middle layer, the middle layer is removed. In order to reduce or prevent damage to other underlying layers exposed by the patterning of the middle layer and intervening layers, an inhibitor is included within an etching process in order to inhibit the amount of material removed from the underlying layers.

Semiconductor device and method of manufacture

A physical vapor deposition (PVD) system is disclosed. The PVD system includes a pedestal configured to hold a semiconductor wafer, a cover plate configured to hold a target, and a collimator between the pedestal and the cover plate. The collimator includes a plurality of passages configured to pass source material travelling from the cover plate toward the pedestal at an angle less than a threshold angle with respect to a line perpendicular to a surface of the pedestal facing the cover plate, where the collimator is configured to block source material travelling from the cover plate toward the pedestal at an angle greater than the threshold angle, where a first passage of the plurality of passages has a first passage length, where a second passage of the plurality of passages has a second passage length, and where the first passage length is less than the second passage length.

A foldable electronic device includes a first casing, a second casing, a hinge structure and a foldable display. The hinge structure connects the first casing and the second casing, and includes a plurality of supporting blocks, a plurality of first hinge blocks and a plurality of second hinge blocks. The supporting blocks are arranged side by side between the first casing and the second casing. The first hinge blocks and the second hinge blocks are respectively arranged at two sides of the supporting blocks. One of the first hinge blocks connects two of the supporting blocks adjacent to each other. One of the second hinge blocks connects two of the supporting blocks adjacent to each other. The foldable display includes a first bonding portion secured to the first casing, a second bonding portion secured to the second casing and a foldable portion aligned to the hinge structure.

Foldable electronic device having foldable display

An electronic device includes a first body, a second body pivoted to the first body and a magnetic force mechanism. The first body includes a driving portion. The second body includes a casing, a flexible display and a supporting mechanism movably disposed in the casing. The flexible display is attached to the supporting mechanism. The magnetic force mechanism is disposed in the casing, wherein a portion of the magnetic force mechanism is exposed from the casing and abuts against the driving portion. The magnetic force mechanism is magnetically coupled to the supporting mechanism, wherein the magnetic force mechanism generates a magnetic attraction force or a magnetic repulsion force to the supporting mechanism by the second body rotating relative to the first body.

Electronic device

A head-mounted display includes a host, two installing bases, two connection elements and a head belt. The host has two installing grooves and two opposite sidewalls, and the two installing grooves respectively penetrate through the two sidewalls. The two installing bases are disposed in the host, wherein each installing base has an abutting portion and an installing portion connected to each other. The abutting portion of each installing base abuts against an inner edge of the corresponding sidewall, and the installing portion of each installing base is exposed outside of the host through the corresponding installing groove. The two connection elements are respectively installed onto the two installing portions of the two installing bases. The head belt has two opposite connection portions, and the two connection portions are respectively connected to the two connection elements.

Head-mounted display

An electronic device includes a first body, a second body pivoted to the first body and a magnetic force mechanism. The first body includes a driving portion. The second body includes a casing, a flexible display and a supporting mechanism movably disposed in the casing. The flexible display is attached to the supporting mechanism. The magnetic force mechanism includes a sliding rod slidably disposed at the casing, a first magnet, a second magnet and a third magnet. The first magnet is disposed at the sliding rod and faces the supporting mechanism. The second magnet and the third magnet are disposed at the supporting mechanism and face the sliding rod. The sliding rod has a driven end exposed from the casing and abuts against the driving portion. The first magnet is aligned with the second magnet or is aligned with the third magnet.

A head-mounted display includes a head belt, a frame, a first locking element, a display assembly and a second locking element. The frame is connected to the head belt. The first locking element is disposed at the peripheral of the frame and includes a first locking portion and an unlocking portion adjacent to each other. The second locking element is disposed at the peripheral of the display assembly and includes a second locking portion. The display assembly is fixed to the frame by means of the second locking portion of the second locking element being locked to the first locking portion of the first locking element. The second locking portion is aligned with the unlocking portion, and the locking relation between the second locking portion of the second locking element and the first locking portion of the first locking element is released by the operation of the unlocking portion.

Head-mounted display having quick assembly and detachment design

A method of manufacturing a semiconductor device includes exposing a material to a semi-aqueous etching solution. The semi-aqueous etching solution comprises a solvent which chelates with the material and acts as a catalyst between the etching driving force and the material. As such, the etching driving force may be used to remove the material.

Semiconductor device and method

A head-mounted display including a body, a bearing base, a separation plate, a knob, a guiding element, a first gear, a second gear and a head belt set is provided. The separation plate is fixed inside the bearing base. The knob is pivoted to the bearing base and located outside the bearing base. The guiding element is pivoted to the bearing base and located inside the bearing base, and is configured to be driven by the knob to rotate. The guiding element includes a shaft portion passing through the bearing base and the separation plate. The first gear and the second gear are sleeved on the shaft portion, and are separated from each other by the separation plate. The head belt set connects the body and the bearing base. The head belt set includes an auxiliary head belt, a first side head belt and a second side head belt.

Growing community of inventors

Taipei, Taiwan

Kuan-Lin Chen