Taiwan Semiconductor Manufacturing Comp. Ltd.

Kuan-Ku Hung

Chen-Hua Douglas Yu

Tsu Shih

A method for preventing or reducing corrosion of copper containing features included in a semiconductor wafer in a chemical mechanical polishing (CMP) process including providing a semiconductor wafer polishing surface including copper filled anisotropically etched features; polishing the semiconductor wafer polishing surface according to a first CMP process including applying at least one polishing slurry to contact the semiconductor wafer polishing surface for removing an uppermost layer of the semiconductor wafer polishing surface; and, alternately applying a copper corrosion inhibitor solution for a period of time and the at least one polishing slurry for a period of time to contact the semiconductor wafer polishing surface to comprise a polishing cycle said polishing cycle performed at least once during at least a second CMP process.

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Changhua, Taiwan

Kuan-Ku Hung