United Microelectronics Corp.

Other

Kuan-Hung Chen

Chun-Tsen Lu

Rung-Yuan Lee

Li-Cheng Richard Zai

Chung-Fu Chang

Chun-Chia Chen

Guang-Yu Lo

Yu-Cheng Tung

En-Chiuan Liou

Chorng-Lih Young

A low friction horizontal probing fixture includes two rails of a base unit and two slide units respectively disposed on and being slidable along the rails. Each slide unit has a slide seat that is disposed adjacent to a respective one of the rails, rolling members that are connected to the slide seat and that are rollable on the respective rail so that the slide seat is movable along the respective rail, and a lock mechanism that is disposed on the slide seat and that is operable to position the slide seat relative to the respective rail. A guiding member is connected co-movably to the slide units.

Low friction horizontal probing fixture

A method for fabricating semiconductor device includes the steps of: forming a fin-shaped structure on a substrate; forming a gate dielectric layer on the fin-shaped structure; forming a gate electrode on the fin-shaped structure; performing a nitridation process to implant ions into the gate dielectric layer adjacent to two sides of the gate electrode; and forming an epitaxial layer adjacent to two sides of the gate electrode.

Semiconductor device and method for fabricating the same

A portable probe stand assembly including a hand-held frame, a gravity tilt unit, and a probe holder. The hand-held frame includes a frame body with a cut-out and two gripping handles. The gravity tilt unit includes a movable part that has a pivot portion rotatably connected to the hand-held frame. The movable part tends to pivot due to gravity to turn the portable probe stand assembly to a hand-held state where a portion of an underside abutting surface of the movable part is disposed out of the cut-out. The portable probe stand assembly is convertible from the hand-held state to a usage state where the movable part is leveled via a pivot movement of the movable part upon engaging the underside abutting surface with a surface of an object.

Portable probe stand assembly

A horizontal probing fixture includes two bridge modules each having two spaced-apart pedestals, and a bridge plate connecting the pedestals. A first sliding unit for carrying and sliding a probe device includes two first sliding blocks respectively mounted and slidable on the bridge plates of the bridge modules, a first slide plate having two opposite ends respectively connecting the first sliding blocks, and two locking modules respectively disposed on the first sliding blocks. Each first sliding block has a bottom end complementarily engaged to and slidable on the bridge plate of one of the bridge modules. The locking modules are operable to respectively lock or unlock the first sliding blocks relative to the bridge plates.

Horizontal probing fixture

A support fixture is adapted for utilization of a test probe, and includes two pedestals and at least one moveable carriage assembly. Each pedestal includes a spacing block and at least one side plate connected to the spacing block extending in a longitudinal direction. The at least one moveable carriage includes a vertical panel and an adjustable holding device. The vertical panel is engaged with the at least one side plate of one of the two pedestals, and is slidable parallel to the longitudinal direction relative to the at least one side plate of each of the two pedestals. The adjustable holding device is operable for fixing the vertical panel to the at least one side plate of the one of the two pedestals and is adapted to hold the test probe.

Support fixture and probe station having the same

A deflecting device includes a base member, an axle member, a probe mounting seat, a swing arm assembly, and an actuating assembly. The axle member is disposed in the base member, and has a front end that extends out of the base member and that is mounted with the probe mounting seat. The swing arm assembly includes a swing arm disposed in the base member, and having an upper end that is formed with a guide slot, and a lower end that is connected to the axle member. The actuating assembly includes a screw member that is mounted to the base member, and a slider member that has an engaging portion slidably engaging the base member and formed with a threaded driven hole that screws with the screw member, and a tubular portion engaging the guide slot.

Deflecting device for a probe

A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a substrate, an isolation structure, an outer structure, and a gate structure. The isolation structure is disposed on the substrate. The outer structure surrounds a sidewall of the isolation structure. The gate structure surrounds a central part of the outer structure, so that the central part covered by the gate structure becomes a channel region, and the outer structure at both sides of the central part respectively becomes a source region and a drain region.

Vertical gate-all-around transistor and manufacturing method thereof

A semiconductor device is provided. The semiconductor device includes a substrate, a semiconductor nanowire, a gate structure, a first metal nanowire and a second metal nanowire. The semiconductor nanowire is disposed vertically on the substrate. The gate structure surrounds a middle portion of the semiconductor nanowire. The first metal nanowire is located on a side of the semiconductor nanowire and is electronically connected to a lower portion of the semiconductor nanowire. The second metal nanowire is located on the other side of the semiconductor nanowire and is electronically connected to the gate structure.

Semiconductor device

A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a substrate, a semiconductor nanowire, a gate structure, a first metal nanowire and a second metal nanowire. The semiconductor nanowire is disposed vertically on the substrate. The gate structure surrounds a middle portion of the semiconductor nanowire. The first metal nanowire is located on a side of the semiconductor nanowire and is electronically connected to a lower portion of the semiconductor nanowire. The second metal nanowire is located on the other side of the semiconductor nanowire and is electronically connected to the gate structure.

Semiconductor device and manufacturing method thereof

A method of fabricating a semiconductor device includes the following steps: providing a semiconductor substrate having a fin structure thereon; forming a recess in the fin structure so that the semiconductor substrate is partially exposed from the bottom surface of the recess; forming a dopant source layer conformally disposed on side surfaces and a bottom surface of the recess; removing the dopant source layer disposed on the bottom surface of the recess until portions of the semiconductor substrate are exposed from the bottom surface of the recess; and annealing the dopant source layer so as to form a side doped region in the fin structure.

Method of fabricating semiconductor device

A semiconductor device and a method of forming the same, the semiconductor device includes a plural fin structures, two gates, a protection layer and an interlayer dielectric layer. The fin structures are disposed on a substrate. The two gates are disposed on the substrate across the fin structures. The protection layer is disposed on the substrate, surrounded sidewalls of the two gates. The interlayer dielectric layer is disposed on the substrate, covering the fin structures and the two gates.

Growing community of inventors

Taichung, Taiwan

Kuan-Hung Chen