Tsinghua University

Merry Electronics Co., Ltd.

Kuan-Hsun Chiu

Sun-Zen Chen

Kuang-Chien Hsieh

Henry J H Chen

Jen-Yi Chen

Chun-Chieh Wang

Hung-Jen Chen

Ming-Li Hsu

A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.

Manufacturing method of a condenser microphone

Condenser microphone and manufacturing method thereof

A MEMS microphone chip with an expanded back chamber includes a first chip unit and a second chip unit. The first chip unit has a first substrate, a vibration membrane layer is formed above an end of the first substrate, and a space is formed below the vibration membrane layer of the first substrate, so that the vibration membrane layer is suspended above the first substrate to vibrate. The second chip unit has a second substrate to couple with another end of the first substrate, and a groove is formed in the second substrate with a width larger than that of the space; when the first substrate and the second substrate are coupled together, the groove and the space are connected together to act as the back chamber of the vibration membrane layer.

Micro-electro-mechanical system microphone chip with expanded back chamber

Growing community of inventors

Taichung, Taiwan

Kuan-Hsun Chiu