Au Optronics Corporation

Auo Corporation

Kuan-Hsun Chen

Yu-Sheng Huang

Yi-Yueh Hsu

Yi-Hsin Lin

Ching-Yi Hsu

Hao-An Chuang

Yu-Lun Chang

Sheng-Chin Wang

Fu-Wei Chan

Hong-Sian Chi

Hui-Di Lu

A display panel includes a package including a substrate, LEDs and a encapsulation adhesive. The substrate includes a bottom surface, a first side and a second side. The first side and the second side are opposite sides, and the bottom surface and the first side form a first angle, the bottom surface and the second side form a second angle. The LEDs are on the substrate. The encapsulation adhesive covers the first side, the second side and the light-emitting diodes. The encapsulation adhesive has a third side adjacent to the first side and a fourth side adjacent to the second side, and the bottom surface and the third side form a third angle, the bottom surface of the first substrate and the fourth side form a fourth angle. The third angle is greater than the first angle, and the fourth angle is smaller than the second angle.

Display panel and forming method thereof

A lamination apparatus is adapted to laminate an encapsulation glue and a panel. The lamination apparatus includes a lower mold, an upper mold, and a cutting knife. The lower mold has a lamination area and a peripheral area adjacent to the lamination area. The panel is adapted to be retained in the lamination area. The upper mold is movable close to or away from the lower mold, and includes an encapsulation glue fixing part. The encapsulation glue fixing part is adapted to fix the encapsulation glue to the upper mold. The cutting knife is disposed in the peripheral area of the lower mold, and is located in a horizontal direction between the lamination area of the lower mold and the encapsulation glue fixing part of the upper mold. In addition, a lamination method is also disclosed.

Lamination apparatus and lamination method

A package structure includes a circuit substrate, a light emitting diode array, a first encapsulant, and a sealant. The circuit substrate includes a top surface and a side surface of the circuit substrate. The light emitting diode array is disposed on the top surface of the circuit substrate. The first encapsulant is disposed above the circuit substrate. The first encapsulant includes a main portion and an extension portion, in which the main portion of the first encapsulant is disposed parallel to the top surface of the circuit substrate, and the extension portion of the first encapsulant extends to the side surface of the circuit substrate. The sealant is disposed below the extension portion of the first encapsulant, and the sealant contacts the first encapsulant and the circuit substrate. The first encapsulant and the sealant together form a coplanar surface.

Package structure and manufacturing method thereof

A display panel includes a substrate, light-emitting diodes, and a cured opaque encapsulant layer. The light-emitting diodes are disposed on a first surface of the substrate. The cured opaque encapsulant layer is disposed on the first surface and a side surface of the substrate, and surrounds the light emitting diodes. A second surface of the cured opaque encapsulant layer facing away from the substrate is a rough surface.

Display panel including opaque encapsulation and doped planarization layers and manufacturing method thereof

Provided is a manufacturing method of an active device substrate including the following steps. A blind hole is formed in a substrate. A first conductive pattern and an active device are formed on a first surface of the substrate, where the first conductive pattern overlaps the blind hole. After the first conductive pattern and the active device are formed, an etching process is executed on the substrate to form a through hole penetrating the substrate at the position of the blind hole. A conductive material is filled into the through hole to form a conductive hole. The conductive hole is electrically connected to the first conductive pattern. A second conductive pattern is formed on a second surface of the substrate, where the second conductive pattern is electrically connected to the first conductive pattern through the conductive hole.

Manufacturing method of active device substrate

A display device includes a pixel circuit and receiving antenna units. The pixel circuit is disposed in the active area, and the pixel circuit includes pixel units. The receiving antenna units are electrically connected to the pixel circuit. The receiving antenna units include a first receiving antenna unit and a second receiving antenna unit. The first receiving antenna unit is configured to provide a first data signal to the pixel units in a first part, and the pixel units in the first part are configured to illuminate at a first brightness. The second receiving antenna unit is configured to provide a second data signal to the pixel units in a second part, and the pixel units in the second part are configured to illuminate at a second brightness.

Display device and driving method thereof

A display device is provided. The display device includes a data signal transmitter and a display panel. The data signal transmitter is used to transmit data signals. A display area of the display panel is divided into sub-display areas. Each sub-display area includes light emitting diodes, a data line, column switches, and row switches. A portion of the data line is formed as a data induction coil to receive one of the data signals by wireless sensing. The display panel selects one of the light emitting diodes as a selected light emitting diode by the column switches and the row switches. The selected light emitting diode is coupled to the data line to form a closed loop. The closed loop generates an induced current according to the data signal and causes the selected light emitting diode to emit light according to the induced current.

Display device

A display panel includes a first substrate, a second substrate, a display medium layer, first peripheral wires, and second peripheral wires. The first substrate has at least one first side surface. The second substrate is disposed opposite to the first substrate, and has at least one second side surface adjacent to the first side surface. Each first peripheral wire includes a first signal line, a first fan-out portion, and a first pad. The first signal lines are disposed between the first substrate and the second substrate, and the first fan-out portions are disposed on the first side surface of the first substrate. Each second peripheral wire includes a second signal line, a second fan-out portion, and a second pad. The second signal lines are disposed between the first substrate and the second substrate, and the second fan-out portions are disposed on the second side surface of the second substrate.

Growing community of inventors

Hsin-Chu, Taiwan

Kuan-Hsun Chen