Universal Scientific Industrial Co., Ltd.

Universal Scientific Industrial (shanghai) Co., Ltd.

Kuan-Hsing Li

Kuo-Hsien Liao

Chuei-Tang Wang

Chia-Yang Chen

Kuo-Hua Tseng

Chih-Hsien Chiu

Hui-Chung Lee

A wireless communication module includes: amounting board including a dielectric frame and a dielectric panel that are stacked together, the frame defining a frame space; at least one electronic component mounted on the mounting board and extending into the frame space; and a plurality of conductive bodies embedded in the dielectric frame and surrounding the frame space so as to prevent electromagnetic interference resulting from the electronic component.

Wireless communication module

An electromagnetic shielding device includes a metal frame mounted on a circuit board and having a looped surrounding wall configured with an inner space divided into first and second space portions by a partition wall unit. A cover is mounted fittingly into the inner space in the metal frame, and includes a dielectric cover body, and a conductive material layer attached to an outer surface of the cover body. The cover body has a looped surrounding wall extending downwardly from a periphery of a top wall and disposed in proximity to the looped surrounding wall of the metal frame such that the conductive material layer is in electrical contact with the looped surrounding wall of the metal frame. The cover cooperates with the metal frame to define first and second cavities having different depths and corresponding respectively to the first and second space portions.

Multi-cavity electromagnetic shielding device

A metallic cover of a miniaturization module includes a substrate, a SMD chip unit and a metallic cover, the metallic cover embracing the SMD chip unit and having at least one sizing hole and a plurality of venting holes, the venting holes being disposed around the sizing hole, and the sizing hole and the venting holes being positioned above the SMD chip unit so that glue portions fill up slits between the metallic cover and the SMD chip unit. The venting holes stop the glue portion from running over the second chip unit. The glue-filled slits between the top lid and the SMD chip unit provides a strong support to prevent any deformation of the metallic cover when the metallic cover is tested and processed.

Metallic cover of miniaturization module

A wireless communication module includes: a module board including a module substrate having opposite first and second surfaces, conductive pads formed on the first surface, and an electronic component mounted to the second surface; a carrier stacked to the module board and having opposite first and second surfaces and a peripheral end that has a peripheral end face extending between the first and second surfaces of the carrier and formed with multiple spaced apart grooves; multiple spaced apart first conductive contacts formed on the first surface of the module substrate, and contacting a respective one of the module contacts; multiple spaced apart second conductive contacts formed on the second surface of the module substrate; and multiple conductive leads that interconnect the first and second conductive contacts.

A planar inverted-F antenna includes a ground element, a shorting element, a radiating element, and a feeding element. The shorting element extends upwardly from the ground element. The radiating element is disposed above the ground element, and extends transversely from the shorting element. The radiating element includes a meandering strip and a flat plate. The meandering strip has opposite first and second ends. The first end of the meandering strip is coupled to the shorting element. The flat plate has a connecting side that is connected to the second end of the meandering strip and that has a length different from that of the second end of the meandering strip. The feeding element has a first end that is connected to the radiating element, and a second end that extends through and that is free from electrical contact with the ground element.

Growing community of inventors

Taichung, Taiwan

Kuan-Hsing Li