Macronix International Co., Ltd.

Kuan-Fu Chen

Ya-Jui Lee

Tzung-Ting Han

Yin-Jen Chen

Ming-Shang Chen

Yu-Fong Huang

Miao-Chih Hsu

Ming Shang Chen

Shang-Wei Lin

I-Shen Tsai

A memory device and programming method thereof are provided. A memory cell array includes a first dummy word line set, plural word lines and a second dummy word line set in sequence. The method includes: grouping the word lines into word line groups; generating at least one pass bias set having plural pass biases that are respectively corresponding to each word line group; selecting one word line for programming, and determining that the selected word line belongs to a specific word line group; and according to a programming sequence, applying a corresponding pass bias in the plural pass biases of the at least one pass bias set to at least one dummy word line in one of the first and the second dummy word line sets, wherein the corresponding pass bias corresponds to the specific word line group.

Memory device and programming method thereof

A flash memory and an erase method thereof are provided. The flash memory includes at least a memory array and a memory control circuit. The memory control circuit biases plural word lines, a common source line and a global bit line included in the memory array to erase plural memory cells in the flash memory. The method comprises grouping the plural word lines into plural word line groups according to erase depths corresponding to each word line; generating an erase voltage and plural multiple-step word line erase voltages; applying the erase voltage from at least one of the common source line and the global bit line; and during a period when the erase voltage is applied, the plural multiple-step word line erase voltages is respectively applied to the plural word line groups, wherein the plural multiple-step word line erase voltages is one-by-one corresponding to the plural word line groups.

Flash memory and erase method thereof

A method for programming a memory device and a memory system are provided, wherein the method for programming the memory device includes steps below. First, a program command is proposed. Second, a width of a pulse about to provide to strings of memory cells of the memory device is determined according to a temperature data of the memory device. Then, the pulse is provided to the strings of memory cells to start doing a program operation. The width of the pulse becomes narrower as a temperature of the memory device is raised.

Method for programming flash memory device and flash memory system

A memory device and a write method thereof are provided. A control circuit performs a first write operation and a first write verification operation on a plurality of memory cells of a non-volatile memory, and after the plurality of memory cells pass the first write verification operation, the control circuit performs a second write verification operation on target memory cells corresponding to at least one target threshold voltage in the plurality of memory cells, and when a failure bit count of the target memory cells is not less than a preset number of bits, the control circuit performs a second write operation and a third write verification operation on the plurality of memory cells.

Memory device and write method thereof

A memory device and a program verification method thereof are provided. The write verification method includes: reading a previous page to obtain first read data, writing input data to a current page, reading the previous page or the current page to obtain second read data, and analyzing at least one of the first read data and the second read data to determine whether to back up at least one of the first read data and the input data to a redundant block of the memory device.

Memory device and program verification method thereof

Methods, systems and apparatus for effectively erasing blocks with few programmed pages are provided. In one aspect, a system includes a memory and a controller coupled to the memory. The memory includes blocks each having pages. The controller is configured to determine whether a threshold page with a particular page number in a block of the memory is programmed, to erase the block according to a normal erase action in response to determining that the threshold page is programmed, and to erase the block according to a particular erasing action that is configured to erase the block deeper than the normal erase action in response to determining that the threshold page is not programmed. The particular erasing action can include pre-programming the block before erasing the block, decreasing an erase verify voltage before erasing the block, or adding one or more erasing pulses with a new erasing voltage.

Erasing blocks with few programmed pages

Provided is an operation method for a memory device. The memory device includes a memory array having a plurality of word lines and a plurality of bit lines. The operation method for the memory device includes: applying a program voltage to at least one selected word line of the word lines; and during a high level of the program voltage, based on respective locations of a plurality of selected bit line, which are to be written into data 0, on the word lines, applying different plurality of bit line voltages to the selected bit line which are to be written into data 0.

Memory device and programming operation method thereof with different bit line voltages

A one-time programmable memory array includes a first row conductor extending in a first row direction and disposed at a first elevation, a second row conductor extending in a second row direction and disposed at a second elevation and a column conductor extending in a column direction and disposed adjacent to the first row conductor and adjacent to the second row conductor. The array also includes a dielectric layer covering at least a portion of the column conductor, a fuse link coupled between the dielectric layer on the column conductor and the second row conductor.

Diode-less array for one-time programmable memory

A memory device and a programming method thereof are provided, and the programming method of the memory device includes following steps. A memory cell grouping procedure is performed to divide a plurality of memory cells into a plurality of groups. After the memory cell grouping procedure is performed, a programming procedure is performed, and the programming procedure includes following steps. A first programming pulse, a second programming pulse and a verification pulse are provided to a word line. A first group is programmed by the first programming pulse, and a second group is programmed by the second programming pulse. Whether the first group and the second group respectively pass a verification operation is determined by the verification pulse.

Programming method for reducing a width of a threshold voltage distribution curve of memory cells

A non-volatile memory and a programming method thereof are provided. The programming method for the non-volatile memory includes: setting at least one first isolation cell between a first side cell and at least one first pass cell of an inhibited memory string; cutting off the at least one first isolation cell and providing a pre-boosting voltage to a word line of the first side cell and at a first time point; turning on the at least one first isolation cell at a second time point for transporting the pre-boosting potential to channels of the at least one first pass cell and a primary cell at a second time period; and providing a boosting voltage to word lines of the at least one first pass cell during a boosting time period.

Non-volatile memory and programming method thereof

A memory device including multiple word lines, multiple bit lines and a memory cell array is provided. The word lines intersect the bit lines, and an included angle between the word lines and the bit lines is not a right angle. The memory cell array includes multiple memory cells respectively disposed at the intersections of the word lines and the bit lines. Each row of the memory cells is electrically connected to one of the word lines, and each column of the memory cells is electrically connected to one of the bit lines.

NAND flash memory device with oblique architecture and memory cell array

A memory device including a substrate, a conductive layer, a charge storage layer, first and second dopant regions and first and second cell dopant regions is provided. A plurality of trenches is deployed in the substrate. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layer is disposed between the substrate and the conductive layer. The first and second dopant regions having a first conductive type are configured in the substrate under bottoms of the trenches and in an upper portion of the substrate between two adjacent trenches, respectively. The first and second cell dopant regions having a second conductive type are configured in the substrate between lower portions of side surfaces of the trenches and in the substrate adjacent to the bottoms of the second dopant regions, respectively. The first and the second conductive types are different dopant types.

Memory device

A memory device is provided, including a substrate, a conductive layer, a charge storage layer, a plurality of isolation structures, a plurality of first doped regions, and a plurality of second doped regions. The substrate has a plurality of trenches. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layer is disposed between the substrate and the conductive layer. The isolation structures are disposed in the substrate between two adjacent trenches, respectively. The first doped regions are disposed in an upper portion of the substrate between each isolation structure and each trench, respectively. The second doped regions are disposed in the substrate under a bottom portion of the trenches, in which each isolation structure is disposed between two adjacent second doped regions.

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Taipei, Taiwan

Kuan-Fu Chen