Innolux Corporation

Innocom Technology(shenzhen) Co., Ltd.

Other

Chimei Innolux Corporation

Red Oak Innovations, LLC

Iinolux Corporation

Kuan-Feng Lee

Yuan-Lin Wu

Tsung-Han Tsai

Chandra Lius

Jui-Jen Yueh

Jia-Yuan Chen

Yu-Chia Huang

Hsiao-Lang Lin

Yu-Hsien Wu

Tzu-Min Yan

Nai-Fang Hsu

Ming-Chang Lin

Yu-Sheng Tsai

Ting-Kai Hung

Kuo-Chang Chiang

Kung-Chen Kuo

Chung-Wen Yen

Wei-Cheng Chu

Tsau-Hua Hsieh

Hui-Chieh Wang

Ming-Chun Tseng

Chia-Hsiung Chang

Lien-Hsiang Chen

Cheng-Hsu Chou

Hsia-Ching Chu

Chao-Hsiang Wang

Chun-Hsien Lin

Tung-Kai Liu

Pai-Chiao Cheng

Chan-Feng Chiu

Chin-Lung Ting

Kuei-Ling Liu

Peng-Cheng Huang

Chih-Yung Hsieh

Shu-Ming Kuo

Chiu-Lien Yang

Hong-Sheng Hsieh

Ying-Tong Lin

Chia-Hung Hsieh

Jin Yi Tan

Yu-Ting Huang

Shun-Yuan Hu

Cheng-Chi Wang

Yi-Ching Chen

Hsin-Hung Lin

Fang-Ying Lin

Kai Cheng

Pei-Chieh Chen

Yi-An Chen

Kuang-Ming Fan

Jung-Fang Chang

Sheng-Nan Chen

Chia-Lin Yang

Hsing-Chien Tuan

Shun-Cheng Chen

Ting-Wei Liang

Chin-Ming Huang

Shou-Pu Yeh

An electronic includes a substrate, at least one driving unit, a first signal line and a second signal line. The substrate has a first side edge extending in a first extension direction and a second side edge extending in a second extension direction. The first side edge and the second side edge are curved in a normal direction of a projection surface of a top surface of the substrate. A curvature of the first side edge is different from a curvature of the second side edge, and the curvatures of the first side edge and the second side edge are not equal to zero. The first signal line and the second signal line are disposed on the substrate. The first signal line is electrically connected to the at least one driving unit, and a curvature of the first signal line is different from a curvature of the second signal line.

Electronic device having curved portion

An electronic device includes a substrate, a plurality of light-emitting units, an encapsulation layer and a plurality of patterns. The plurality of light-emitting units are disposed on the substrate. The encapsulation layer is disposed on the plurality of light-emitting units. The plurality of patterns are disposed on the encapsulation layer, overlap with at least a portion of the plurality of light-emitting units, and overlap with at least a portion of the encapsulation layer. In a top view of the electronic device, a first part of the plurality of patterns and a second part of the plurality of patterns are different in length.

Electronic device

An electronic device includes an electronic unit, a circuit layer and a bonding pad. The electronic unit includes a chip, an insulating layer and a first conductor layer. The insulating layer is disposed on the chip, the insulating layer includes a first opening, and the first conductor layer is disposed in the first opening. The circuit layer is disposed corresponding to the electronic unit, and the circuit layer includes a second opening and a second conductor layer disposed in the second opening. The bonding pad is in contact with the second conductor layer, and the bonding pad is electrically connected to electronic unit. The first conductor layer has a first height, the second conductor layer has a second height, and a ratio of the first height to the second height is greater than or equal to 0.1 and less than or equal to 0.9.

A manufacturing method of an electronic device is provided. The method includes providing a substrate, providing a plurality of signal lines on the substrate, providing a first pad on the substrate, providing a second pad on the substrate, and providing a first electronic component. The first electronic component includes a first electrode. One of the plurality of signal lines is connected to the first pad, and the first electrode of the first electronic component is connected to the first pad. The method further includes removing the first electronic component from the substrate when the first electronic component is dysfunctional, and providing a second electronic component on the substrate and connected to the second pad.

Manufacturing method of an electronic device

A display panel includes a substrate and a pixel circuit. The pixel circuit is disposed on the substrate. The pixel circuit is configured to drive a light-emitting unit. The pixel circuit includes a first conductive line, a second conductive line disposed adjacent the first conductive line, a third conductive line and a fourth conductive line. The first conductive line and the second conductive line are disposed between the third conductive line and the fourth conductive line. The first conductive line, the second conductive line, the third conductive line, and the fourth conductive line extend along the same direction. The first distance Ybetween the first conductive line and the second conductive line and the second distance Ybetween the third conductive line and the fourth conductive line conform to the following relationship: 0≤Y/Y≤0.25.

Display panel

The disclosure provides a display device which includes a first light-emitting unit, a second light-emitting unit, a first color filter and a second color filter. The first color filter is disposed on the first light-emitting unit, wherein the first color filter is in a color of blue. The second color filter is disposed on the second light-emitting unit, wherein the second color filter and the first color filter are different in color. The first color filter has a first width W1, a first distance D1 is between the first color filter and the first light-emitting unit, the second color filter has a second width W2, and a second distance D2 is between the second color filter and the second light-emitting unit. The first width, the second width, the first distance and the second distance satisfy tan[(W1/2)/D1]>tan[(W2/2)/D2].

An electronic device includes a substrate, an electronic element, a layer, a plurality of first bonding pads, a transistor and a plurality of second bonding pads. The electronic element is disposed on the substrate. The layer is disposed between the substrate and the electronic element. The plurality of first bonding pads are disposed corresponding to the electronic element. The transistor is electrically connected with the electronic element through the plurality of first bonding pads. The substrate is disposed between the plurality of first bonding pads and the plurality of second bonding pads. The transistor is disposed between the plurality of first bonding pads and the substrate.

An electronic device is provided. The electronic device includes a substrate, a metal layer, a plurality of diodes, a first transistor, and a second transistor. The metal layer is overlapped with the substrate and includes a plurality of holes. The diodes are disposed on the substrate. The first transistor and the second transistor are disposed on the substrate and electrically connected to one of the diodes, the gate electrodes of the first transistor and the second transistor overlap a same semiconductor, and the one of the diodes overlaps the first transistor and doesn't overlap the second transistor.

An electronic device includes a stretchable substrate, a plurality of first electronic units and a plurality of second electronic units. The stretchable substrate has a plurality of island portions and a plurality of bridge portions, and each of the bridge portions connecting at least two of the island portions. The first electronic units are disposed on the island portions. The second electronic units are disposed on the stretchable substrate, each of the second electronic units includes a mesh pattern disposed on at least one of the island portions, and the mesh pattern includes a first opening overlapped with at least one of the first electronic units.

An electronic device includes a first substrate, a second substrate overlapped with the first substrate and having a first side and a second side opposite to the first side, a sensor unit disposed between the first substrate and the second substrate, a first blocking layer disposed on the first side, and a second blocking layer disposed on the sensor unit. The second side is disposed between the sensor unit and the first side. The first blocking layer has a first opening, and the second blocking layer has a second opening. A width of the first opening is smaller than a width of the second opening.

An electronic device is provided by the present disclosure. The electronic device includes a first main structure, a second main structure adjacent to the first main structure, a connecting structure connecting the first main structure and the second main structure, a first semiconductor disposed on the first main structure and a first insulating structure disposed between the first semiconductor and the first main structure, wherein the first insulating structure has a first groove.

The present disclosure provides a display device including a display panel and a lens layer. The display panel has a normal region and a camera region, in which the normal region includes a plurality of first light emitting units, and the camera region includes a plurality of second light emitting units. The lens layer is disposed on the normal region and the camera region, and the lens layer includes a plurality of first lenses overlapped with the first light emitting units and a plurality of second lenses overlapped with the second light emitting units. A density of the first lenses in the normal region is greater than a density of the second lenses in the camera region.

Display device

A flexible display apparatus includes a display module, a metal plate and a sensor. The display module has a flexible area. The metal plate is disposed under the display module, and the metal plate includes a patterned portion overlapped with the flexible area. The sensor has a sensing layer disposed at a first side of the metal plate close to the display module and a sensing driving component electrically connected to the sensing layer and disposed at a second side of the metal plate opposite to the first side.

Flexible display apparatus

An array substrate structure is provided, which includes a substrate with a first surface and a second surface opposite to the first surface. A first TFT is on the first surface of the substrate, and a second TFT is on the second surface of the substrate. A through via passes through the substrate, and the first TFT is electrically connected to the second TFT through the through via.

Array substrate structure

A method of manufacturing an electronic device, comprising: providing a carrier substrate with a plurality of light-emitting units disposed thereon, the plurality of light-emitting units being spaced with a first pitch (P) in a first direction and a second pitch (P) in a second direction that is perpendicular to the first direction; providing a driving substrate; and transferring at least a portion of the plurality of light-emitting units to the driving substrate to form a transferred portion of the plurality of light-emitting units on the driving substrate, the transferred portion being spaced with a third pitch (P) in a third direction and a fourth pitch (P) in a fourth direction that is perpendicular to the third direction; wherein the first pitch (P), the second pitch (P), the third pitch (P), and the fourth pitch (P) are satisfied following relations: P=mP; and P=nP, m and n are positive integers.

Electronic device comprising a transferred portion of plurality of chips and method for manufacturing the same

Growing community of inventors

Miao-Li County, Taiwan

Kuan-Feng Lee